Keyphrases
Subsurface Damage
100%
Continuous-wave Laser
88%
High Power
83%
Optics
62%
Optical Materials
57%
High Power Laser
57%
Optical Glass
50%
Annealing
50%
All-silica
50%
Piezoelectric Single Crystal
50%
Spinel
50%
GdCOB
50%
Silica Aerogel
50%
Microroughness
37%
ReCOB
33%
Optical Properties
29%
Destructive Behavior
29%
Single Crystal Materials
29%
Electromechanical Coupling Coefficient
29%
Peak-to-valley
27%
Property Database
25%
Optical Crystal
25%
Sapphire Crystal
25%
Non-invasive Method
25%
Continuous Wave
25%
Yttrium Aluminum Garnet
25%
Ultra-high Temperature
25%
Damaged Layer
25%
High Reflectivity
25%
Stress Damage
25%
Removal Methods
25%
Surface Roughness
25%
Stress Mitigation
25%
Single-crystalline
25%
Non-destructive Method
25%
Near-infrared Absorption
25%
Diamond
25%
Damage Mitigation
25%
Nanotexture
25%
High Temperature piezoelectric
25%
Sensor Applications
25%
Gadolinium
25%
Oxyborate
25%
MgAl2O4 Spinel
25%
Fused Silica
25%
Laser Fluence
25%
Chemical Fingerprint
25%
Laser Damage Threshold
24%
Low Absorption
23%
Laser Applications
22%
Material Science
Silicon Dioxide
100%
Optical Material
79%
Thin Films
65%
Density
51%
Annealing
50%
Optical Property
50%
Optical Glass
50%
Single Crystal
50%
Piezoelectricity
50%
Laser Application
48%
Film
41%
Reflectivity
39%
Electromechanical Coupling
37%
Refractive Index
29%
Magnesium
27%
Laser Source
25%
Laser Ablation
25%
Thermal Property
25%
Gadolinium
25%
Birefringence
25%
Dielectric Material
25%
Magnetron Sputtering
25%
Anisotropy
25%
Brittleness
25%
Electrical Resistivity
25%
Surface Roughness
25%
Fiber Laser
25%
Diamond
25%
Coating Process
25%
Fracture Toughness
25%
Sapphire
14%
Infrared Glass
12%
Machining
12%
Crack Initiation
12%
Surface Damage
12%
Permittivity
12%
Interferometer
12%
Crystal Growth From Melt
12%
Polycrystal
12%
Multilayer
12%
Surface Stress
12%
Material Property Database
12%
Young's Modulus
12%
Silicon Carbide
12%
Engineering
Subsurface
100%
Continuous Wave
79%
Thin Films
70%
Piezoelectric
50%
Electromechanical Coupling Factor
37%
Power Laser
34%
Dielectrics
29%
Refractive Index
29%
Laser Application
27%
Application of Sensors
25%
Laser Surface
25%
Annealing Process
25%
Space Group
25%
Grinding (Machining)
25%
Surface Layer
25%
Promising Candidate
25%
Surface Processing
25%
Brittle Material
25%
Power Requirement
25%
Diamond
25%
Quality Factor
25%
Yttrium-Aluminum-Garnet
25%
Piezoelectric Coefficient
25%
Compressive Stress
25%
Sensing Application
25%
Fused Silica
25%
Laser Fluence
25%
Silica Aerogels
25%
Induced Damage
19%
Abrasive Size
16%
Irradiance
14%
Interferometry
13%
Flexure
12%
Dimensional Stability
12%
Optical Path
12%
Potential Source
12%
Initiation of Crack
12%
Coating Material
12%
Room Temperature
12%
Pulsed Laser Ablation
12%
Mechanical Removal Process
12%
Removal Process
12%
Breakage
12%
Operating Wavelength
12%
Crack Initiation
12%
Short Pulse Laser
12%
