Projects per year
Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Dive into the research topics where Madhavan Swaminathan is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Fuse2 Topic 2: Heterogeneously Integrated Arrays for Massively Scalable sub-THz Communications and Sensing
Lee, W. (PI), Rodwell, M. J. W. (CoPI) & Swaminathan, M. (CoPI)
10/15/24 → 9/30/27
Project: Research project
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IUCRC Phase II Georgia Institute of Technology: Center for Advanced Electronics through Machine Learning [CAEML]
Swaminathan, M. (PI)
10/1/23 → 3/31/27
Project: Research project
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RINGS: Just-in-Time Security: Adaptive Physical-Layer Security for NextG Low-Latency mmWave Wireless Networks
Bloch, M. R. (PI), Swaminathan, M. (CoPI) & Raychowdhury, A. (CoPI)
5/1/22 → 4/30/26
Project: Research project
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IUCRC Phase II University of Illinois Urbana Champaign: Center for Advanced Electronics through Machine Learning (CAEML)
Rosenbaum, E. (PI), Franzon, P. D. (CoPI) & Swaminathan, M. (CoPI)
4/15/22 → 3/31/27
Project: Research project
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IUCRC Phase II North Carolina State University: Center for Advanced Electronics through Machine Learning [CAEML]
Rosenbaum, E. (CoPI), Franzon, P. D. (PI) & Swaminathan, M. (CoPI)
4/15/22 → 3/31/27
Project: Research project
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Antenna-Integrated and PA-Embedded Glass Substrates for D-Band InP Power Amplifier Modules
Jia, X., Li, X., Woo Kim, J., Moon, K. S., Rodwell, M. J. W. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 4, p. 782-791 10 p.Research output: Contribution to journal › Article › peer-review
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Broadband Characterization of Interconnects in Die-Embedded Glass Interposer
Erdogan, S., Jia, X., Li, X., Kathaperumal, M., Agarwal, R. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 4, p. 766-773 8 p.Research output: Contribution to journal › Article › peer-review
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Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications
Dwarakanath, S., Bhaskar, P., Kanno, K., Nimbalkar, P. C., Kathaperumal, M., Raj Pulugurtha, M., Swaminathan, M. & Tummala, R. R., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 1, p. 131-139 9 p.Research output: Contribution to journal › Article › peer-review
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Design and demonstration of dual-core spiral package-embedded inductors for Integrated Voltage Regulators
Avula, V., Murali, P. & Swaminathan, M., 2025, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › peer-review
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Substrate-Embedded Microfluidic Cooling of Distributed Vertical Power Delivery Architectures for High-Performance Computing Processors
Choi, M., Krishnakumar, S., Khorasani, R. R., Swaminathan, M., Partin-Vaisband, I. & Kumar, S., 2025, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › peer-review