Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 7 Affordable and Clean Energy
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Collaborations and top research areas from the last five years
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Fuse2 Topic 2: Heterogeneously Integrated Arrays for Massively Scalable sub-THz Communications and Sensing
Lee, W. (PI), Rodwell, M. J. W. (CoPI) & Swaminathan, M. (CoPI)
10/15/24 → 9/30/27
Project: Research project
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IUCRC Phase II Georgia Institute of Technology: Center for Advanced Electronics through Machine Learning [CAEML]
Swaminathan, M. (PI)
10/1/23 → 3/31/27
Project: Research project
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RINGS: Just-in-Time Security: Adaptive Physical-Layer Security for NextG Low-Latency mmWave Wireless Networks
Bloch, M. R. (PI) & Swaminathan, M. (CoPI)
5/1/22 → 4/30/26
Project: Research project
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IUCRC Phase II University of Illinois Urbana Champaign: Center for Advanced Electronics through Machine Learning (CAEML)
Franzon, P. D. (PI), Franzon, P. D. (CoPI) & Swaminathan, M. (CoPI)
4/15/22 → 3/31/27
Project: Research project
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IUCRC Phase II Georgia Institute of Technology: Center for Advanced Electronics through Machine Learning [CAEML]
Swaminathan, M. (PI), Franzon, P. D. (CoPI) & Rosenbaum, E. (CoPI)
4/15/22 → 12/31/23
Project: Research project
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Integrated Circuit-on-Glass (ICoG): A Self-Packaged 3D-Heterogeneous Integration (3DHI) Platform for Millimeter-Wave Circuits With Embedded GaN-on-Si Dielets
Yadav, P., Li, X., Palacios, T. & Swaminathan, M., 2026, In: IEEE Transactions on Microwave Theory and Techniques. 74, 1, p. 63-72 10 p.Research output: Contribution to journal › Article › peer-review
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3D Vertical Glass Stacking for 6G Communications - Interconnect Fabrication and Broadband Characterization
Li, X., Kumar, L. N. V. & Swaminathan, M., 2025, Proceedings - IEEE 75th Electronic Components and Technology Conference, ECTC 2025. Institute of Electrical and Electronics Engineers Inc., p. 1412-1416 5 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Link opens in a new tab Scopus citations -
Advances in Package Microvia Interconnects: Breakthroughs with Picosecond UV Laser Ablation
Liu, F., Zhang, R., Kimiyuki, K., Kim, J. W., Swaminathan, M. & Tummala, R. R., 2025, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › peer-review
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Antenna-Integrated and PA-Embedded Glass Substrates for D-Band InP Power Amplifier Modules
Jia, X., Li, X., Woo Kim, J., Moon, K. S., Rodwell, M. J. W. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 4, p. 782-791 10 p.Research output: Contribution to journal › Article › peer-review
7 Link opens in a new tab Scopus citations -
Broadband Characterization of Interconnects in Die-Embedded Glass Interposer
Erdogan, S., Jia, X., Li, X., Kathaperumal, M., Agarwal, R. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 4, p. 766-773 8 p.Research output: Contribution to journal › Article › peer-review