Calculated based on number of publications stored in Pure and citations from Scopus
1986 …2023

Research activity per year

Network

Y. D. Chan

  • SEMATECH
  • Pennsylvania State University
  • Rockwell Collins
  • On assignment to SEMATECH
  • Electron. Mat. and Proc. Res. Lab.

External person

Stephen S.J. Fonash

  • Pennsylvania State University
  • Harris Semiconductor Reliability Engineering
  • NanoHorizons
  • Solarity LLC
  • IEEE
  • SEMATECH
  • 227 Hammond Building
  • Corning Incorporated
  • Penn State Univ.
  • Mostek Inc.

External person

K. Sarpatwari

  • IEEE
  • Pennsylvania State University
  • Micron Technology Incorporated
  • Department of Engineering Science and Mechanics
  • Materials Research Institute
  • Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Engineering Science and Mechanics
  • Department of Engineering Science and Mechanics
  • Department of Engineering Science and Mechanics
  • The Department of Engineering Science and Mechanics
  • Engineering Science and Mechanics Department
  • NanoMM-Nanoengineered Metamaterials Group
  • Department of Engineering Science and Mechanics
  • Penn State Smeal College of Business
  • Penn State Univ.

External person

B. Monemar

  • Linköping University
  • Department of Physics and Measurement Technology
  • Department of Physics and Measurement Technology
  • Department of Physics

External person

T. Gu

  • SEMATECH
  • Pennsylvania State University
  • Optical Imaging Systems, Incorporated
  • Electron. Mat. and Proc. Res. Lab.

External person

L. Trabzon

  • Intersil Corp.
  • Pennsylvania State University
  • Istanbul Technical University
  • Electron. Mat. and Proc. Res. Lab.
  • Dept. of Mechanical Eng.
  • Harris Semiconductor Reliability Engineering

External person

J. Hao

  • Intersil Corp.
  • Fairchild Semiconductor, Inc.
  • Fairchild Semiconductor Corporation
  • Pennsylvania State University
  • Electron. Mat. and Proc. Res. Lab.
  • ON Semiconductor Corporation
  • Device and Process Reliability
  • onsemi
  • Harris Semiconductor Reliability Engineering
  • Penn State Univ.

External person

S. J. Fonash

  • Corning Incorporated
  • Intersil Corp.
  • Pennsylvania State University
  • Engineering Science Program The Pennsylvania State University University Park
  • NanoHorizons
  • 112 Lubert Building
  • 227 Hammond Building
  • Metals Science and Engineering Program, Penn State
  • IEEE
  • SEMATECH
  • Mostek Inc.
  • Solarity LLC
  • Center for Electronic Materials and Processing and The Engineering Science Program
  • Engineering Science Program
  • Electron. Mat. and Proc. Res. Lab.
  • LLC
  • Engineering Science and Mechanics Department
  • Center for Nanotechnology Education and Utilization (CNEU)
  • Department of Engineering Science and Mechanics
  • Nanofabrication Facility
  • Ctr. Nanotechnol. Educ. and Utiliz.
  • 107 Whitmore Lab.
  • Department of Engineering Science and Mechanics
  • Materials Research Institute
  • Department of Engineering Science and Mechanism
  • Penn State College of Medicine
  • Harris Semiconductor Reliability Engineering

External person

Chandraprakash Chindam

  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Pennsylvania State University
  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Engineering Science and Mechanics Department
  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Pennsylvania State University, Department of Engineering Science and Mechanics
  • Penn State Univ.

External person

Yaozu Wang

  • Pennsylvania State University
  • Anadigics Incorporated
  • Electron. Mat. and Proc. Res. Lab.
  • II-VI Incorporated

External person

R. S. Ridley

  • Intersil Corp.
  • Pennsylvania State University
  • Fairchild Semiconductor Corporation
  • Fairchild Semiconductor
  • Fairchild Semiconductor, Inc.
  • Electron. Mat. and Proc. Res. Lab.
  • Harris Semiconductor Reliability Engineering

External person

G. Dolny

  • Intersil Corp.
  • Pennsylvania State University
  • Fairchild Semiconductor Corporation
  • Fairchild Semiconductor
  • Fairchild Semiconductor, Inc.
  • Electron. Mat. and Proc. Res. Lab.
  • Harris Semiconductor Reliability Engineering

External person

J. Werking

  • SEMATECH
  • Pennsylvania State University
  • Electron. Mat. and Proc. Res. Lab.

External person

J. L. Lindström

  • Swedish Defence Research Agency

External person

P. I. Mikulan

  • Pennsylvania State University
  • Electron. Mat. and Proc. Res. Lab.

External person

Ibrahim H. Khawaji

  • Taibah University
  • Pennsylvania State University
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • Penn State Univ.

External person

C. Knoedler

  • Intersil Corp.
  • Pennsylvania State University
  • Fairchild Semiconductor Corporation
  • Electron. Mat. and Proc. Res. Lab.
  • Harris Semiconductor Reliability Engineering

External person

A. Henry

  • Linköping University
  • Swedish Defence Research Agency
  • IBM
  • Department of Physics and Measurement Technology

External person

Wasim Orfali

  • Taibah University
  • Architectural Engineering Department

External person

Ting Zhu

  • Pennsylvania State University
  • Department of Engineering Science and Mechanics
  • Department of Engineering Science and Mechanics
  • The Department of Engineering Science and Mechanics
  • NanoMM-Nanoengineered Metamaterials Group
  • Department of Electrical Engineering
  • Engineering Science and Mechanics Department
  • Department of Engineering Science
  • Department of Engineering Science and Mechanics
  • Department of Engineering Science and Mechanics
  • NanoMM-Nanoengineered Metamaterials Group
  • Penn State University
  • Penn State Univ.

External person

W. M. Chen

  • Linköping University
  • Department of Physics and Measurement Technology
  • Department of Physics

External person

A. Lund

  • Linköping University
  • Department of Physics and Measurement Technology
  • Institute of Physics and Measurement Technology

External person

H. Weman

  • Linköping University
  • Department of Physics and Measurement Technology
  • Department of Physics and Measurement Technology
  • Department of Physics

External person

R. A. Ditizio

  • Pennsylvania State University
  • SEMATECH
  • Electron. Mat. and Proc. Res. Lab.
  • Processing Research Laboratory

External person

Fan Zhang

  • Pennsylvania State University
  • Department of Engineering Science and Mechanics
  • Engineering Science and Mechanics Department
  • Penn State University
  • Penn State Univ.

External person

Fred Preuninger

  • Alcatel-Lucent
  • SEMATECH
  • SEMATECH from ATandT
  • Nokia

External person

J. F. Rembetski

  • SEMATECH
  • IBM
  • IBM

External person

A. Salah

  • Pennsylvania State University
  • Electron. Mat. and Proc. Res. Lab.

External person

T. Grebs

  • Intersil Corp.
  • Pennsylvania State University
  • Fairchild Semiconductor Corporation
  • Fairchild Semiconductor
  • Electron. Mat. and Proc. Res. Lab.
  • Harris Semiconductor Reliability Engineering

External person

C. T. Wu

  • Pennsylvania State University
  • Fairchild Semiconductor Corporation
  • Fairchild Semiconductor, Inc.
  • Department of Electrical Engineering
  • Center for Nanoscale Science and Department of Electrical Engineering
  • Penn State Univ.

External person

M. Okandan

  • Pennsylvania State University
  • IEEE

External person

Amartya Ghosh

  • ON Semiconductor Corporation
  • Pennsylvania State University
  • Penn State Univ.

External person

G. Bersuker

  • IEEE
  • SEMATECH
  • Pennsylvania State University
  • Front End Process Division
  • Electron. Mat. and Proc. Res. Lab.

External person

J. Zeng

  • Pennsylvania State University
  • Fairchild Semiconductor Corporation
  • Electron. Mat. and Proc. Res. Lab.
  • Intersil Corp.
  • Harris Semiconductor Reliability Engineering

External person

J. Jiang

  • Pennsylvania State University
  • Electron. Mat. and Proc. Res. Lab.
  • Department of Engineering Science and Mechanics

External person

Motasim G. El Hassan

  • Intel
  • Pennsylvania State University
  • Memory Components Division
  • Electron. Mat. and Proc. Res. Lab.

External person

Reece Kingi

  • Pennsylvania State University

External person

C. Kocon

  • Intersil Corp.
  • Pennsylvania State University
  • Fairchild Semiconductor Corporation
  • Electron. Mat. and Proc. Res. Lab.
  • Harris Semiconductor Reliability Engineering

External person

Mark Rioux

  • Fairchild Semiconductor, Inc.
  • Fairchild Semiconductor Corporation

External person

Milagros Ozaita

  • Pennsylvania State University
  • Electron. Mat. and Proc. Res. Lab.

External person

N. Gollagunta

  • Intersil Corp.
  • Pennsylvania State University
  • Electron. Mat. and Proc. Res. Lab.
  • Harris Semiconductor Reliability Engineering

External person

N. Gallogunta

  • Pennsylvania State University
  • Electron. Mat. and Proc. Res. Lab.

External person

Xinyu Wang

  • Pennsylvania State University
  • Penn State Univ.

External person

Michael Cook

  • ON Semiconductor Corporation
  • Process and Device Reliability Lab

External person

John L. Crowley

  • C and C Technologies

External person

J. Michalowicz

  • Fairchild Semiconductor Corporation
  • Fairchild Semiconductor, Inc.

External person

James C. Sturm

  • Princeton University
  • Center for Photonic and Optoelectronic Materials
  • Electrical Engineering Department

External person

Y. Zhang

  • SUNY Albany
  • Department of Physics

External person

B. Venkataraman

  • Pennsylvania State University
  • Department of Engineering Science and Mechanics
  • Penn State Univ.

External person

D. O. Lee

  • Pennsylvania State University
  • Primaxx, Inc.
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Center for Nanoscale Science and Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Penn State Univ.

External person

M. W. Allen

  • Department of Electrical and Computer Engineering
  • University of Canterbury

External person

P. Roman

  • Pennsylvania State University
  • Primaxx, Inc.
  • The Electrochemical Society
  • X-ion
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Electron. Mat. and Proc. Res. Lab.
  • Department of Electrical Engineering
  • Penn State Univ.

External person

E. Sagstuen

  • University of Oslo
  • Department of Physics

External person

J. Benjamin

  • Pennsylvania State University
  • Fairchild Semiconductor Corporation
  • Electron. Mat. and Proc. Res. Lab.

External person

N. S. Dellas

  • Pennsylvania State University
  • Ocean NanoTech, LLC
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Material Science and Engineering
  • Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Materials Research Institute
  • Ocean NanoTech, LLC

External person

Sigurd Wagner

  • Princeton University
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • Electrical Engineering Department

External person

J. W. Corbett

  • SUNY Albany
  • Department of Physics

External person

Antoine Kahn

  • Princeton University
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

J. Jiang

  • Penn State Univ.

External person

S. M. Durbin

  • Purdue University
  • University of Canterbury
  • SUNY Buffalo
  • Florida State University
  • Intel
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Physics Dept.
  • Department of Physics
  • Department of Electrical Engineering
  • School of Electrical Engineering
  • Advanced Design Group
  • Department of Physics
  • FAMU-FSU College of Engineering
  • Western Michigan University
  • State University of New York at Buffalo

External person

C. R. Viswanathan

  • SEMATECH
  • University of California at Los Angeles
  • Univ. of California

External person

P. O. Samskong

  • Linköping University
  • Department of Physics and Measurement Technology

External person

T. T. Koo

  • Pennsylvania State University

External person

C. Chandraprakash

  • Department of Mechanical Engineering
  • Indian Institute of Technology Kanpur

External person

M. W. Kuo

  • Pennsylvania State University
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Penn State Univ.

External person

Theresa Mayer

  • Pennsylvania State University
  • Virginia Polytechnic Institute and State University
  • Penn State Univ.
  • Virginia Tech College of Engineering

External person

Gavin D.R. Hall

  • ON Semiconductor Corporation

External person

Vijayakumar C. Venugopal

  • Pennsylvania State University
  • CATMAS - Compl. Theor. Mat. Sci. G.
  • Lam Research Corporation
  • Compl. Theor. Mat. Sci. Grp. (C.
  • Engineering Science and Mechanics Department
  • Materials Research Laboratory
  • Department of Engineering Science
  • Department of Engineering Science and Mechanics
  • Fiat Lux Technologies
  • Penn State Univ.

External person

C. Hallin

  • Linköping University
  • Department of Physics and Measurement Technology

External person

J. Masiakowski

  • Linköping University
  • Adam Mickiewicz University in Poznań
  • Institute of Physics and Measurement Technology
  • Nonlinear Optics Division

External person

Howard Hovagimian

  • Pennsylvania State University

External person

T. Begum

  • Linköping University
  • Department of Physics and Measurement Technology

External person

B. G. Svensson

  • Swedish Defence Research Agency

External person

Xiaoyu Li

  • SEMATECH
  • University of California at Los Angeles
  • Univ. of California

External person

J. Westerling

  • Linköping University
  • Institute of Physics and Measurement Technology

External person

P. O. Samskog

  • Linköping University

External person

P. Aum

  • SEMATECH

External person

Yuan Min Li

  • Pennsylvania State University

External person

E. Boden

  • SEMATECH

External person

Chris Kendrick

  • ON Semiconductor Corporation

External person

T. T. Ho

  • Department of Electrical Engineering
  • Pennsylvania State University
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Penn State Univ.

External person

Stephen J. Fonash

  • Pennsylvania State University

External person

D. G. Ast

  • Cornell University
  • Department of Materials Science and Engineering

External person

Evrim Colak

  • Ankara University

External person

John Mehlhaff

  • Pennsylvania State University

External person

Atilla Ozgur Cakmak

  • Pennsylvania State University
  • Penn State Univ.

External person

Vyshnavi Suntharalingam

  • Pennsylvania State University

External person

J. G. Couillard

  • Cornell University
  • Department of Materials Science and Engineering

External person

M. Lindgren

  • Linköping University

External person

J. Hao

  • Pennsylvania State University
  • Electron. Mat. and Proc. Res. Lab.
  • Hong Kong Polytechnic University

External person

Terry M. Peterson

  • Electric Power Research Institute

External person

Alyssa N. Brigeman

  • Pennsylvania State University
  • Department of Electrical Engineering
  • Zin Technologies
  • Penn State Univ.

External person

O. Claesson

  • Linköping University
  • Department of Physics and Measurement Technology

External person

Tom Kopley

  • ON Semiconductor Corporation

External person