Sukwon Choi
Contact Expert

View Scopus Profile

Sukwon Choi

    Calculated based on number of publications stored in Pure and citations from Scopus
    20062024

    Research activity per year

    Filter
    Conference contribution

    Search results

    • 2023

      Characterization of GaN-on-SiC Wafers using a Multi-Method Laser-Based Pump-Probe Technique

      Song, Y., Shoemaker, D., Kang, K., Schuette, M., Tweedie, J. S., Sheppard, S. T. & Choi, S., 2023, Proceedings of the 22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2023-May).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    • 2022

      Deep-Ultraviolet Thermoreflectance Thermal Imaging of GaN High Electron Mobility Transistors

      Shoemaker, D. C., Karim, A., Kendig, D., Kim, H. & Choi, S., 2022, Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2022-May).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

      2 Scopus citations

    • Device-level Transient Cooling of ß-Ga2O3MOSFETs

      Kim, S. H., Spencer Lundh, J., Shoemaker, D., Chatterjee, B., Chabak, K. D., Green, A. J., Liddy, K., Graham, S. & Choi, S., 2022, Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2022-May).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

      1 Scopus citations

    • EXPERIMENTAL PROBING of the BIAS DEPENDENT SELF-HEATING in ALGAN/GAN HEMTS with A TRANSPARENT INDIUM TIN OXIDE GATE

      Karim, A., Kim, T. K., Shoemaker, D., Song, Y., Kwak, J. S. & Choi, S., 2022, Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022. American Society of Mechanical Engineers (ASME), v001t09a011. (Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    • 2021

      The effectiveness of heat extraction by the drain metal contact of ß-Ga2O3 MOSFETs

      Kim, S. H., Shoemaker, D., Chatterjee, B., Chabak, K. D., Green, A. J., Liddy, K. J., Jessen, G. H., Graham, S. & Choi, S., 2021, Proceedings of the 20th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2021. IEEE Computer Society, p. 324-327 4 p. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2021-June).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

      1 Scopus citations
    • 2020

      Characterization of the Thermal Boundary Resistance of a Ga2O3/4H-SiC Composite Wafer

      Song, Y., Chatterjee, B., McGray, C., Zhukovsky, S., Leach, J. H., Hess, T., Foley, B. M. & Choi, S., Jul 2020, Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020. IEEE Computer Society, p. 154-157 4 p. 9190287. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2020-July).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

      2 Scopus citations
    • 2019

      Correlated effects of self-heating, light output, and efficiency of GaN light-emitting diodes on junction temperature

      Chatterjee, B., Lundh, J. S., Shoemaker, D., Kim, T. K., Kwak, J. S., Cho, J. & Choi, S., 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019. American Society of Mechanical Engineers (ASME), (ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    • Enhancement of the electrical and thermal performance of AlGaN/GaN HEMTs using a novel resistive field plate structure

      Chatterjee, B., Kim, T. K., Song, Y., Lundh, J. S., Han, S. W., Shoemaker, D., Lee, J. M., Cho, M. U., Chu, R., Kwak, J. S. & Choi, S., May 2019, Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society, p. 362-369 8 p. 8757330. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2019-May).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

      4 Scopus citations

    • Integrated optical probing of the thermal dynamics of wide bandgap power electronics

      Lundh, J. S., Song, Y., Chatterjee, B., Baca, A. G., Kaplar, R. J., Armstrong, A. M., Allerman, A. A., Kim, H. & Choi, S., 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019. American Society of Mechanical Engineers (ASME), (ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

      1 Scopus citations
    • 2018

      Temperature and Stress Metrology of Ultra-Wide Bandgap β-Ga2O3 Thin Films

      Chatterjee, B., Leach, J. H., Dhar, S. & Choi, S., Jul 24 2018, Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018. Institute of Electrical and Electronics Engineers Inc., p. 202-207 6 p. 8419526. (Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

      3 Scopus citations
    • 2017

      Electro-thermal reliability study of GaN high electron mobility transistors

      Chatterjee, B., Lundh, J. S., Dallas, J., Kim, H. & Choi, S., Jul 25 2017, Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017. Institute of Electrical and Electronics Engineers Inc., p. 1247-1252 6 p. 7992627. (Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

      24 Scopus citations

    • Integrated temperature mapping of lateral gallium nitride electronics

      Lundh, J. S., Chatterjee, B., Dallas, J., Kim, H. & Choi, S., Jul 25 2017, Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017. Institute of Electrical and Electronics Engineers Inc., p. 320-327 8 p. 7992488. (Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

      9 Scopus citations

    • Steady state and transient thermal characterization of vertical GaN PIN diodes

      Pavlidis, G., Dallas, J., Choi, S., Shen, S. C. & Graham, S., 2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, (ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

      2 Scopus citations

    • Thermal characterization of GaN vertical p-i-n diodes

      Dallas, J., Pavlidis, G., Chatterjee, B., Lundh, J. S., Ji, M., Kim, J., Kao, T., Detchprohm, T., Dupuis, R. D., Shen, S., Graham, S. & Choi, S., Jul 25 2017, Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017. Institute of Electrical and Electronics Engineers Inc., p. 328-333 6 p. 7992489. (Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

      2 Scopus citations
    • 2006

      Water transport experiment of the PEFC based on a generic experimental method

      Choi, S., Chu, K., Ryu, J. & Sunwoo, M., Dec 1 2006, 2006 IEEE Vehicle Power and Propulsion Conference, VPPC 2006. 4211339. (2006 IEEE Vehicle Power and Propulsion Conference, VPPC 2006).

      Research output: Chapter in Book/Report/Conference proceeding › Conference contribution