Advancing Thermo-Optical Metrology for Integrated Circuitry (ATOMIC)

This project aims to develop a super-resolution thermal metrology tool that enables accurate characterization of the thermal resistance of semiconductor materials, heterostructures and devices, particularly wide bandgap and ultra-wide bandgap materials and devices at the nanometer length scale. The tool will be capable of characterizing both epilayers and operating devices with a thermal resolution of less than 0.25 °C, thermal precision of 1 °C, spatial resolution below 50 nm, accuracy above 90%, and reproducibility and repeatability of less than 2%. During the base period, the Nano-probe Thermoreflectance Microscopy (NTM) thermal metrology tool will be designed. Then, the thermal resistance, thermal boundary resistance, and local temperature rise measurement capabilities will be demonstrated individually and then integrated together. The team will perform validation experiments including thermal resistance, temperature, and thermal resolution of the surface and cross-section of GaN and AlGaN transistors with less than 100 nm spatial resolution. Finally, the team will demonstrate and confirm that the complete NTM system meets the program requirements. During the option period, the automated, push-button thermal metrology tool will be designed in coordination with the designated U.S. government organization. The team will then build and deliver the automated, turn-key NTM system to the designated organization.