Chip-Package Co-Design Methodology for Integrated RF Microsystems

Keyphrases

1. Co-design Method 100%
2. Integrated RF 100%
3. RF Circuits 66%
4. Digital Circuits 33%
5. Copper Metal 33%
6. Al Metal 33%
7. Chip Design 33%
8. Metal Technology 33%
9. Georgia Tech 33%
10. Digital Domain 33%
11. Circuitry 33%
12. System-on-chip 33%
13. Circuit Design 33%
14. Analog Circuits 33%
15. RF Passives 33%
16. CMOS Technology 33%
17. Multiple Domains 33%
18. Circuit Performance 33%
19. Digital-physical 33%
20. Component Optimization 33%
21. Microsystems 33%
22. Metal Deposition 33%
23. Metal Layer 33%
24. Electronic Packaging 33%
25. Package Technology 33%
26. Floorplanning 33%
27. Physical Design 33%
28. Design Environment 33%