2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using electromagnetic band GAP structures

Nithya Sankaran; Suzanne Huh; Madhavan Swaminathan; Rao Tummala

doi:10.1109/EPEP.2008.4675906

2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using electromagnetic band GAP structures

Nithya Sankaran
, Suzanne Huh
, Madhavan Swaminathan
, Rao Tummala

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

This paper for the first time demonstrates the use of Electromagnetic Band Gap (EBG) structures for isolation between multiple plane pairs along the vertical direction. Planar EBG structures have been applied for the suppression of vertical noise coupling in the GHz range of frequencies. Simulation and measurement results showing good isolation in the stop bands of the EBGs are presented.

Original language	English (US)
Title of host publication	Electrical Performance of Electronic Packaging, EPEP 2008
Pages	173-176
Number of pages	4
DOIs	https://doi.org/10.1109/EPEP.2008.4675906
State	Published - 2008
Event	17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 - San Jose, CA, United States Duration: Oct 27 2008 → Oct 29 2008

Publication series

Name	Electrical Performance of Electronic Packaging, EPEP

Conference

Conference	17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008
Country/Territory	United States
City	San Jose, CA
Period	10/27/08 → 10/29/08

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/EPEP.2008.4675906

Cite this

Sankaran, N., Huh, S., Swaminathan, M., & Tummala, R. (2008). 2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using electromagnetic band GAP structures. In Electrical Performance of Electronic Packaging, EPEP 2008 (pp. 173-176). Article 4675906 (Electrical Performance of Electronic Packaging, EPEP). https://doi.org/10.1109/EPEP.2008.4675906

@inproceedings{6be156d8eadd46d0a7407310858d8189,

title = "2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using electromagnetic band GAP structures",

abstract = "This paper for the first time demonstrates the use of Electromagnetic Band Gap (EBG) structures for isolation between multiple plane pairs along the vertical direction. Planar EBG structures have been applied for the suppression of vertical noise coupling in the GHz range of frequencies. Simulation and measurement results showing good isolation in the stop bands of the EBGs are presented.",

author = "Nithya Sankaran and Suzanne Huh and Madhavan Swaminathan and Rao Tummala",

year = "2008",

doi = "10.1109/EPEP.2008.4675906",

language = "English (US)",

isbn = "9781424428731",

series = "Electrical Performance of Electronic Packaging, EPEP",

pages = "173--176",

booktitle = "Electrical Performance of Electronic Packaging, EPEP 2008",

note = "17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 ; Conference date: 27-10-2008 Through 29-10-2008",

}

Sankaran, N, Huh, S, Swaminathan, M & Tummala, R 2008, 2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using electromagnetic band GAP structures. in Electrical Performance of Electronic Packaging, EPEP 2008., 4675906, Electrical Performance of Electronic Packaging, EPEP, pp. 173-176, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, San Jose, CA, United States, 10/27/08. https://doi.org/10.1109/EPEP.2008.4675906

2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using electromagnetic band GAP structures. / Sankaran, Nithya; Huh, Suzanne; Swaminathan, Madhavan et al.
Electrical Performance of Electronic Packaging, EPEP 2008. 2008. p. 173-176 4675906 (Electrical Performance of Electronic Packaging, EPEP).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - 2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using electromagnetic band GAP structures

AU - Sankaran, Nithya

AU - Huh, Suzanne

AU - Swaminathan, Madhavan

AU - Tummala, Rao

PY - 2008

Y1 - 2008

N2 - This paper for the first time demonstrates the use of Electromagnetic Band Gap (EBG) structures for isolation between multiple plane pairs along the vertical direction. Planar EBG structures have been applied for the suppression of vertical noise coupling in the GHz range of frequencies. Simulation and measurement results showing good isolation in the stop bands of the EBGs are presented.

AB - This paper for the first time demonstrates the use of Electromagnetic Band Gap (EBG) structures for isolation between multiple plane pairs along the vertical direction. Planar EBG structures have been applied for the suppression of vertical noise coupling in the GHz range of frequencies. Simulation and measurement results showing good isolation in the stop bands of the EBGs are presented.

UR - https://www.scopus.com/pages/publications/58049120031

UR - https://www.scopus.com/pages/publications/58049120031#tab=citedBy

U2 - 10.1109/EPEP.2008.4675906

DO - 10.1109/EPEP.2008.4675906

M3 - Conference contribution

AN - SCOPUS:58049120031

SN - 9781424428731

T3 - Electrical Performance of Electronic Packaging, EPEP

SP - 173

EP - 176

BT - Electrical Performance of Electronic Packaging, EPEP 2008

T2 - 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008

Y2 - 27 October 2008 through 29 October 2008

ER -

2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using electromagnetic band GAP structures

Abstract

Publication series

Conference

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this