2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems (InterPACK)

Baris Dogruoz; Pradeep Lall; Przemyslaw Gromala; Sukwon Choi; Damena Agonafer

2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems (InterPACK)

Baris Dogruoz, Pradeep Lall, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer

Research output: Contribution to journal › Editorial › peer-review

Original language	English (US)
Article number	v001t00a001
Journal	Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021
State	Published - 2021
Event	ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021 - Virtual, Online Duration: Oct 26 2021 → Oct 28 2021

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Hardware and Architecture

Cite this

Dogruoz, B., Lall, P., Gromala, P., Choi, S., & Agonafer, D. (2021). 2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems (InterPACK). Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021, Article v001t00a001.

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title = "2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems (InterPACK)",

author = "Baris Dogruoz and Pradeep Lall and Przemyslaw Gromala and Sukwon Choi and Damena Agonafer",

year = "2021",

language = "English (US)",

journal = "Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021",

note = "ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021 ; Conference date: 26-10-2021 Through 28-10-2021",

}

2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems (InterPACK). / Dogruoz, Baris; Lall, Pradeep; Gromala, Przemyslaw et al.
In: Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021, 2021.

Research output: Contribution to journal › Editorial › peer-review

TY - JOUR

T1 - 2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems (InterPACK)

AU - Dogruoz, Baris

AU - Lall, Pradeep

AU - Gromala, Przemyslaw

AU - Choi, Sukwon

AU - Agonafer, Damena

PY - 2021

Y1 - 2021

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UR - http://www.scopus.com/inward/citedby.url?scp=85120449378&partnerID=8YFLogxK

M3 - Editorial

AN - SCOPUS:85120449378

JO - Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021

JF - Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021

M1 - v001t00a001

T2 - ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021

Y2 - 26 October 2021 through 28 October 2021

ER -

2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems (InterPACK)

All Science Journal Classification (ASJC) codes

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Cite this