3. Chip-package co-design of RF mixed signal microsystems

Developing RF mixed-signal systems-on-chip presents enormous challenges for chip designers due to the sheer complexity involved in integrating RF, analog and digital circuitry on a single die. Furthermore advances in packaging technology has made it possible to design such complex systems in multiple dies on packages such as MCM-L (laminated PWB), MCM-C (ceramic), and MCM-D (thin-film dielectrics). The varied nature of these issues mentioned requires that the designer have a broad area of expertise, limiting the applications and the designers. There is a need to simplify RF mixed-signal design through the development of design rules for integrated receivers with various packages as a design metric. Along with this there needs to be a comprehensive chip-package co-design methodology that will help facilitate an optimum system level design. This tutorial will help the participant understand a design methodology, along with complimentary design rules, the homodyne receiver shown as a test vehicle. Broadly, the entire system design can be divided into two tasks - integration of RF front end using both the chip and package and integration of RF analog mixed signal design on various types of packages.