TY - GEN
T1 - 3D Glass-Based Panel-Level Package with Antenna and Low-Loss Interconnects for Millimeter-Wave 5G Applications
AU - Watanabe, Atom O.
AU - Lin, Tong Hong
AU - Ali, Muhammad
AU - Ogawa, Tomonori
AU - Raj, P. Markondeya
AU - Tentzeris, Manos M.
AU - Tummala, Rao R.
AU - Swaminathan, Madhavan
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/8
Y1 - 2019/8
N2 - This paper reports the first demonstration of antenna-in-package and seamless antenna-to-receiver signal transitions on panel-scale processed ultra-thin glass substrates, for high-speed 5G communication standards in the 28 GHz band. To demonstrate the benefits of g 1 ass for 5 G communications, package-integrated antennas with feedlines were modeled and designed on ultra-thin glass substrates laminated with low-loss dielectric thin films for highest bandwidth and efficiency in the mm-wave bands. The measured results for a miniaturized Yagi-Uda antenna, transmission lines, and through-package vias showed superior dimensional stability and good agreement with the simulated values on 100 μm glass substrates. The results showed low interconnect signal losses with a microstrip line loss of 0.108 dB/mm, and a through-package via loss of 0.095 dB/TPV. The Yagi-Uda antenna fabricated on glass substrates showed a center frequency of 28.18 GHz with a fractional bandwidth of 21.1%. The antenna also presented a wide-angle main lobe at the target frequency range implying good coverage of signal transmitting and receiving. The performance of package-integrated antenna, feedlines, through-package vias, and transmission lines on glass substrates was benchmarked in comparison to other 5G substrate technologies such as organic laminate, ceramic-based substrates, or fan-out wafer level packaging.
AB - This paper reports the first demonstration of antenna-in-package and seamless antenna-to-receiver signal transitions on panel-scale processed ultra-thin glass substrates, for high-speed 5G communication standards in the 28 GHz band. To demonstrate the benefits of g 1 ass for 5 G communications, package-integrated antennas with feedlines were modeled and designed on ultra-thin glass substrates laminated with low-loss dielectric thin films for highest bandwidth and efficiency in the mm-wave bands. The measured results for a miniaturized Yagi-Uda antenna, transmission lines, and through-package vias showed superior dimensional stability and good agreement with the simulated values on 100 μm glass substrates. The results showed low interconnect signal losses with a microstrip line loss of 0.108 dB/mm, and a through-package via loss of 0.095 dB/TPV. The Yagi-Uda antenna fabricated on glass substrates showed a center frequency of 28.18 GHz with a fractional bandwidth of 21.1%. The antenna also presented a wide-angle main lobe at the target frequency range implying good coverage of signal transmitting and receiving. The performance of package-integrated antenna, feedlines, through-package vias, and transmission lines on glass substrates was benchmarked in comparison to other 5G substrate technologies such as organic laminate, ceramic-based substrates, or fan-out wafer level packaging.
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U2 - 10.1109/IMC-5G47857.2019.9160350
DO - 10.1109/IMC-5G47857.2019.9160350
M3 - Conference contribution
AN - SCOPUS:85091934559
T3 - 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond, IMC-5G 2019
BT - 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond, IMC-5G 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond, IMC-5G 2019
Y2 - 15 August 2019 through 16 August 2019
ER -