3D-ICs with self-healing capability for thermal effects in RF circuits

Abhilash Goyal, Madhavan Swaminathan, Abhijit Chatterjee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

In this paper, a new self-healing methodology is proposed for designing 3D-ICs with self-correctable circuits for thermal effects. Therefore, this methodology enables 3D-ICs to work properly without designing/introducing sophisticated heat removing capabilities around them. It is important to note that the proposed methodology is independent to the process node technologies (CMOS or BJT) and can be used for several kinds of circuits. In addition, this self-healing methodology for thermal effects is not limited to 3D-ICs; this methodology can also be implemented in the conventional 2D-ICs for their better performance in harsh temperature conditions. In the proposed methodology, the temperature or heat around the circuit is monitored using the on-chip sensor. After sensing heat, the circuit is calibrated in the right direction to avoid any performance degradation because of the thermal effects. In this paper, the algorithm to calibrate the circuit is proposed and in addition to that a simple on-chip sensor is presented to achieve the self-healing. The proposed methodology is demonstrated by designing RF LNA and RF Oscillator. To the authors best knowledge this is the first work on self-healing in the area of 3D-ICs for thermal effects.

Original languageEnglish (US)
Title of host publicationProceedings of the 15th International Symposium on Quality Electronic Design, ISQED 2014
PublisherIEEE Computer Society
Pages179-183
Number of pages5
ISBN (Print)9781479939466
DOIs
StatePublished - 2014
Event15th International Symposium on Quality Electronic Design, ISQED 2014 - Santa Clara, CA, United States
Duration: Mar 3 2014Mar 5 2014

Publication series

NameProceedings - International Symposium on Quality Electronic Design, ISQED
ISSN (Print)1948-3287
ISSN (Electronic)1948-3295

Conference

Conference15th International Symposium on Quality Electronic Design, ISQED 2014
Country/TerritoryUnited States
CitySanta Clara, CA
Period3/3/143/5/14

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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