TY - GEN
T1 - 3D-ICs with self-healing capability for thermal effects in RF circuits
AU - Goyal, Abhilash
AU - Swaminathan, Madhavan
AU - Chatterjee, Abhijit
PY - 2014
Y1 - 2014
N2 - In this paper, a new self-healing methodology is proposed for designing 3D-ICs with self-correctable circuits for thermal effects. Therefore, this methodology enables 3D-ICs to work properly without designing/introducing sophisticated heat removing capabilities around them. It is important to note that the proposed methodology is independent to the process node technologies (CMOS or BJT) and can be used for several kinds of circuits. In addition, this self-healing methodology for thermal effects is not limited to 3D-ICs; this methodology can also be implemented in the conventional 2D-ICs for their better performance in harsh temperature conditions. In the proposed methodology, the temperature or heat around the circuit is monitored using the on-chip sensor. After sensing heat, the circuit is calibrated in the right direction to avoid any performance degradation because of the thermal effects. In this paper, the algorithm to calibrate the circuit is proposed and in addition to that a simple on-chip sensor is presented to achieve the self-healing. The proposed methodology is demonstrated by designing RF LNA and RF Oscillator. To the authors best knowledge this is the first work on self-healing in the area of 3D-ICs for thermal effects.
AB - In this paper, a new self-healing methodology is proposed for designing 3D-ICs with self-correctable circuits for thermal effects. Therefore, this methodology enables 3D-ICs to work properly without designing/introducing sophisticated heat removing capabilities around them. It is important to note that the proposed methodology is independent to the process node technologies (CMOS or BJT) and can be used for several kinds of circuits. In addition, this self-healing methodology for thermal effects is not limited to 3D-ICs; this methodology can also be implemented in the conventional 2D-ICs for their better performance in harsh temperature conditions. In the proposed methodology, the temperature or heat around the circuit is monitored using the on-chip sensor. After sensing heat, the circuit is calibrated in the right direction to avoid any performance degradation because of the thermal effects. In this paper, the algorithm to calibrate the circuit is proposed and in addition to that a simple on-chip sensor is presented to achieve the self-healing. The proposed methodology is demonstrated by designing RF LNA and RF Oscillator. To the authors best knowledge this is the first work on self-healing in the area of 3D-ICs for thermal effects.
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U2 - 10.1109/ISQED.2014.6783322
DO - 10.1109/ISQED.2014.6783322
M3 - Conference contribution
AN - SCOPUS:84899475071
SN - 9781479939466
T3 - Proceedings - International Symposium on Quality Electronic Design, ISQED
SP - 179
EP - 183
BT - Proceedings of the 15th International Symposium on Quality Electronic Design, ISQED 2014
PB - IEEE Computer Society
T2 - 15th International Symposium on Quality Electronic Design, ISQED 2014
Y2 - 3 March 2014 through 5 March 2014
ER -