3D integration and characterization of high Q passives on multilayer liquid crystalline polymer (M-LCP) based substrate

Wansuk Yun, Amit Bavisi, Venky Sundaram, Madhavan Swaminathan, Ege Engin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

This paper presents 3D integration and characterization of high Q passives on a novel multilayer LCP based substrate. Twelve inductors were characterized from two different locations of the 9" × 12" multilayer LCP panel. The highest Q of 126 was achieved with 2.75nH at 3.7GHz. The inductors range from 2.75 to 17.8nH and Qs range from 50 - 126. Inductors in various embedded layers have been characterized for realization of 3D integration in multilayer LCP substrate for multi-band systems. Using these high Q passives, three different band pass filters were simulated and measured. This 3D integration and characterization will provide an optimized 3D integration for high performance and compact size.

Original languageEnglish (US)
Title of host publicationAPMC 2005
Subtitle of host publicationAsia-Pacific Microwave Conference Proceedings 2005
DOIs
StatePublished - 2005
EventAPMC 2005: Asia-Pacific Microwave Conference 2005 - Suzhou, China
Duration: Dec 4 2005Dec 7 2005

Publication series

NameAsia-Pacific Microwave Conference Proceedings, APMC
Volume1

Conference

ConferenceAPMC 2005: Asia-Pacific Microwave Conference 2005
Country/TerritoryChina
CitySuzhou
Period12/4/0512/7/05

All Science Journal Classification (ASJC) codes

  • General Engineering

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