This paper presents 3D integration and characterization of high Q passives on a novel multilayer LCP based substrate. Twelve inductors were characterized from two different locations of the 9" × 12" multilayer LCP panel. The highest Q of 126 was achieved with 2.75nH at 3.7GHz. The inductors range from 2.75 to 17.8nH and Qs range from 50 - 126. Inductors in various embedded layers have been characterized for realization of 3D integration in multilayer LCP substrate for multi-band systems. Using these high Q passives, three different band pass filters were simulated and measured. This 3D integration and characterization will provide an optimized 3D integration for high performance and compact size.