TY - GEN
T1 - 3D integration and characterization of high Q passives on multilayer liquid crystalline polymer (M-LCP) based substrate
AU - Yun, Wansuk
AU - Bavisi, Amit
AU - Sundaram, Venky
AU - Swaminathan, Madhavan
AU - Engin, Ege
PY - 2005
Y1 - 2005
N2 - This paper presents 3D integration and characterization of high Q passives on a novel multilayer LCP based substrate. Twelve inductors were characterized from two different locations of the 9" × 12" multilayer LCP panel. The highest Q of 126 was achieved with 2.75nH at 3.7GHz. The inductors range from 2.75 to 17.8nH and Qs range from 50 - 126. Inductors in various embedded layers have been characterized for realization of 3D integration in multilayer LCP substrate for multi-band systems. Using these high Q passives, three different band pass filters were simulated and measured. This 3D integration and characterization will provide an optimized 3D integration for high performance and compact size.
AB - This paper presents 3D integration and characterization of high Q passives on a novel multilayer LCP based substrate. Twelve inductors were characterized from two different locations of the 9" × 12" multilayer LCP panel. The highest Q of 126 was achieved with 2.75nH at 3.7GHz. The inductors range from 2.75 to 17.8nH and Qs range from 50 - 126. Inductors in various embedded layers have been characterized for realization of 3D integration in multilayer LCP substrate for multi-band systems. Using these high Q passives, three different band pass filters were simulated and measured. This 3D integration and characterization will provide an optimized 3D integration for high performance and compact size.
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U2 - 10.1109/APMC.2005.1606257
DO - 10.1109/APMC.2005.1606257
M3 - Conference contribution
AN - SCOPUS:33847130093
SN - 078039433X
SN - 9780780394339
T3 - Asia-Pacific Microwave Conference Proceedings, APMC
BT - APMC 2005
T2 - APMC 2005: Asia-Pacific Microwave Conference 2005
Y2 - 4 December 2005 through 7 December 2005
ER -