3D Ultrasound Microbubbles Localization Using Object Detection Model

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Ultrasound Localization Microscopy (ULM) is a cutting-edge imaging technique that unveils the intricate microvascular structures within organs. This method relies on the dynamic properties of microbubbles as contrast agents combined with sophisticated post-processing algorithms to achieve high-resolution imaging. Despite its success in 2D super-resolution medical imaging, the ULM faces significant challenges when applied in 3D ULM, including trade-offs between accuracy, time consumption, and the handling of complex data with substantial memory requirements. Addressing these challenges necessitates innovative approaches to improve the efficiency and accuracy of ULM analysis. In this work, we proposed a 3D object detection convolutional neural network to solve MBs localization, which outputs the coordinates of the predicated MBs and their corresponding confidence scores. The precision accuracy can reach up to 2.6 pixels, and the Jaccard index is up to 91%. In addition, the processing time for each frame was 0.003 s.

Original languageEnglish (US)
Title of host publicationIEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, UFFC-JS 2024 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350371901
DOIs
StatePublished - 2024
Event2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, UFFC-JS 2024 - Taipei, Taiwan, Province of China
Duration: Sep 22 2024Sep 26 2024

Publication series

NameIEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, UFFC-JS 2024 - Proceedings

Conference

Conference2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, UFFC-JS 2024
Country/TerritoryTaiwan, Province of China
CityTaipei
Period9/22/249/26/24

All Science Journal Classification (ASJC) codes

  • Signal Processing
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Acoustics and Ultrasonics
  • Instrumentation

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