A Circuit to Eliminate Serial Skew in High-Speed Serial Communication Channels

Mrinal J. Sarmah, Syed Azeemuddin

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

This brief relates to communication established through high-speed serial links. A serial communication channel can be formed by grouping multiple high-speed serial communication lanes to achieve greater serial bandwidth. Such channels require circuitry to eliminate relative skew across multiple lanes to ensure data integrity in the receiver. Channel bonding is a mechanism used to synchronize serial communication channels in larger data rate and bandwidth applications. This brief presents an approach to channel bonding that optimizes area, power, and initialization time and yields better performance. The ideas discussed here use a delay-based model and explore the possibility of performing channel bonding in a centralized way. The methodology is deployed in the Aurora Protocol Solution Suite, and a comparative analysis with another state-of-the-art approach is performed.

Original languageEnglish (US)
Article number7206537
Pages (from-to)1179-1183
Number of pages5
JournalIEEE Transactions on Circuits and Systems II: Express Briefs
Volume62
Issue number12
DOIs
StatePublished - Dec 2015

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'A Circuit to Eliminate Serial Skew in High-Speed Serial Communication Channels'. Together they form a unique fingerprint.

Cite this