TY - GEN
T1 - A dynamic model of electrostrictive unimorph actuators for haptic devices
AU - Safwat, Tahzib
AU - Tosto, Ryan
AU - Grissom, Michael D.
AU - Rahn, Christopher D.
N1 - Publisher Copyright:
Copyright © 2016 by ASME.
PY - 2016
Y1 - 2016
N2 - Piezoelectric materials are commonly found in many devices, but their usage is limited by the low strain and high stiffness of the material. This prevents their use in "soft" applications, such as compliant actuators for haptic feedback devices and wearable technology. The actuation dynamics of a ferroelectric relaxor terpolymer, a type of soft and high strain electroactive polymer (EAP), are examined. This paper studies the unimorph actuator via a linearized time-domain model and experiments to validate the model include step response and frequency response of tip displacement.
AB - Piezoelectric materials are commonly found in many devices, but their usage is limited by the low strain and high stiffness of the material. This prevents their use in "soft" applications, such as compliant actuators for haptic feedback devices and wearable technology. The actuation dynamics of a ferroelectric relaxor terpolymer, a type of soft and high strain electroactive polymer (EAP), are examined. This paper studies the unimorph actuator via a linearized time-domain model and experiments to validate the model include step response and frequency response of tip displacement.
UR - http://www.scopus.com/inward/record.url?scp=85007380653&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85007380653&partnerID=8YFLogxK
U2 - 10.1115/DETC2016-60512
DO - 10.1115/DETC2016-60512
M3 - Conference contribution
AN - SCOPUS:85007380653
T3 - Proceedings of the ASME Design Engineering Technical Conference
BT - 18th International Conference on Advanced Vehicle Technologies; 13th International Conference on Design Education; 9th Frontiers in Biomedical Devices
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2016 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2016
Y2 - 21 August 2016 through 24 August 2016
ER -