TY - GEN
T1 - A flexible step-up modular multilevel converter for high-power drive application
AU - Farzamkia, Saleh
AU - Khoshkbar-Sadigh, Arash
AU - Iman-Eini, Hossein
AU - Hosseini, Seyyed Hossein
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/6
Y1 - 2020/6
N2 - A flexible step-up modular multilevel converter (MMC) is proposed in this paper with a potential for high-power motor drive applications. Increasing the DC-link voltage utilization up to three times is the main advantage of the proposed structure over the conventional MMCs. Using the proposed structure in motor drive systems decreases the required DC-link voltage which leads to a significant reduction in the rate and size of the rectifier stage. Having one-degree of freedom in design, DC-link short-circuit fault blocking capability, and ease of design and control are among other features of the proposed structure. Detailed formulation of reference signals and circulating current of the proposed structure along with comparative simulation and experimental results validate the performance of the proposed structure.
AB - A flexible step-up modular multilevel converter (MMC) is proposed in this paper with a potential for high-power motor drive applications. Increasing the DC-link voltage utilization up to three times is the main advantage of the proposed structure over the conventional MMCs. Using the proposed structure in motor drive systems decreases the required DC-link voltage which leads to a significant reduction in the rate and size of the rectifier stage. Having one-degree of freedom in design, DC-link short-circuit fault blocking capability, and ease of design and control are among other features of the proposed structure. Detailed formulation of reference signals and circulating current of the proposed structure along with comparative simulation and experimental results validate the performance of the proposed structure.
UR - http://www.scopus.com/inward/record.url?scp=85096532795&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85096532795&partnerID=8YFLogxK
U2 - 10.1109/ITEC48692.2020.9161514
DO - 10.1109/ITEC48692.2020.9161514
M3 - Conference contribution
AN - SCOPUS:85096532795
T3 - 2020 IEEE Transportation Electrification Conference and Expo, ITEC 2020
SP - 314
EP - 319
BT - 2020 IEEE Transportation Electrification Conference and Expo, ITEC 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 IEEE Transportation Electrification Conference and Expo, ITEC 2020
Y2 - 23 June 2020 through 26 June 2020
ER -