TY - GEN
T1 - A fully-integrated 94-GHz 16-element dual-output phased-array transmitter in SiGe BiCMOS with PSAT>6.5 dBm up to 105 °c
AU - Lee, Wooram
AU - Ozdag, Caglar
AU - Aydogan, Yigit
AU - Plouchart, Jean Olivier
AU - Yeck, Mark
AU - Cabuk, Alper
AU - Kepkep, Asim
AU - Apaydin, Emre
AU - Valdes-Garcia, Alberto
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/12/26
Y1 - 2017/12/26
N2 - A 94-GHz 16-element phased array transmitter IC in a 130 nm BiCMOS technology is reported. The IC integrates 16 transmitter front ends with two independent outputs, a 1-to-16 power splitter, an IF-to-RF up-converter, a frequency synthesizer with continuous lock detection, an IF/baseband, and digital circuitry including serial interface and front-end memory within an IC size of 6.7 mm × 5.6 mm. A milimeter-wave (mmWave) up-conversion mixer design is introduced which enables a TX output signal-to-LO leakage ratio higher than 35 dB. On-wafer measurements at 94GHz taken at 25°C show IF-to-RF conversion gain of 35 dB, oP1dB of 4 dBm, Psat of 7.8 dBm and 360° phase shift capability per element, with a total power consumption of 3 W. The IC maintains Psat > 6.5 dBm at 94 GHz up to 105 °C.
AB - A 94-GHz 16-element phased array transmitter IC in a 130 nm BiCMOS technology is reported. The IC integrates 16 transmitter front ends with two independent outputs, a 1-to-16 power splitter, an IF-to-RF up-converter, a frequency synthesizer with continuous lock detection, an IF/baseband, and digital circuitry including serial interface and front-end memory within an IC size of 6.7 mm × 5.6 mm. A milimeter-wave (mmWave) up-conversion mixer design is introduced which enables a TX output signal-to-LO leakage ratio higher than 35 dB. On-wafer measurements at 94GHz taken at 25°C show IF-to-RF conversion gain of 35 dB, oP1dB of 4 dBm, Psat of 7.8 dBm and 360° phase shift capability per element, with a total power consumption of 3 W. The IC maintains Psat > 6.5 dBm at 94 GHz up to 105 °C.
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U2 - 10.1109/CSICS.2017.8240454
DO - 10.1109/CSICS.2017.8240454
M3 - Conference contribution
AN - SCOPUS:85045966718
T3 - 2017 IEEE Compound Semiconductor Integrated Circuit Symposium, CSICS 2017
SP - 1
EP - 4
BT - 2017 IEEE Compound Semiconductor Integrated Circuit Symposium, CSICS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 39th IEEE Compound Semiconductor Integrated Circuit Symposium, CSICS 2017
Y2 - 22 October 2017 through 25 October 2017
ER -