TY - GEN
T1 - A High-Performance Digitally Programmable FVF-Based LDO for Efficient Power Management in Driving Distributed Loads Using a Shared Power Grid
AU - Papreja, Ashish
AU - K.k, Rakesh
AU - Polkampally, Aravind
AU - Azeemuddin, Syed
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Modern System on Chip (SoC) seeks multiple LDOs to provide regulated supply to its different peripherals. However, distributed LDOs across the chip increase power consumption and at the same time, each driver requires a separate transient detection block to reduce the undershoot/overshoot, increasing the area. The work presents a viable solution to tackle such issues by proposing a Multi-loop LDO that uses distributed Flipped Voltage Follower (FVF) drivers. The topology presents one central unit common to every distributed FVF driver across the chip that acts as a global loop, whereas each FVF loop serves as a fast local loop. The proposed power grid structure reduces the overshoot/undershoot voltage without adding additional transient detection schemes. The work depicts design and simulation results to validate the proposed idea with four distributed drivers in 180 nm TSMC node. Simulation results show that the proposed technique helps reduce the droop voltage by more than 40% compared to conventional structures without increasing the design complexity.
AB - Modern System on Chip (SoC) seeks multiple LDOs to provide regulated supply to its different peripherals. However, distributed LDOs across the chip increase power consumption and at the same time, each driver requires a separate transient detection block to reduce the undershoot/overshoot, increasing the area. The work presents a viable solution to tackle such issues by proposing a Multi-loop LDO that uses distributed Flipped Voltage Follower (FVF) drivers. The topology presents one central unit common to every distributed FVF driver across the chip that acts as a global loop, whereas each FVF loop serves as a fast local loop. The proposed power grid structure reduces the overshoot/undershoot voltage without adding additional transient detection schemes. The work depicts design and simulation results to validate the proposed idea with four distributed drivers in 180 nm TSMC node. Simulation results show that the proposed technique helps reduce the droop voltage by more than 40% compared to conventional structures without increasing the design complexity.
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U2 - 10.1109/MWSCAS57524.2023.10405968
DO - 10.1109/MWSCAS57524.2023.10405968
M3 - Conference contribution
AN - SCOPUS:85185388919
T3 - Midwest Symposium on Circuits and Systems
SP - 855
EP - 859
BT - 2023 IEEE 66th International Midwest Symposium on Circuits and Systems, MWSCAS 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 IEEE 66th International Midwest Symposium on Circuits and Systems, MWSCAS 2023
Y2 - 6 August 2023 through 9 August 2023
ER -