TY - GEN
T1 - A hybrid SoC interconnect with dynamic TDMA-based transaction-less buses and on-chip networks
AU - Richardson, Thomas D.
AU - Nicopoulos, Chrysostomos
AU - Park, Dongkook
AU - Narayanan, Vijaykrishnan
AU - Xie, Yuan
AU - Das, Chita
AU - Degalahal, Vijay
PY - 2006
Y1 - 2006
N2 - The two dominant architectural choices for implementing efficient communication fabrics for SoC's have been transaction-based buses and packet-based Networks-on-Chip (NoC). Both implementations have some inherent disadvantages - the former resulting from poor scalability and the transactional character of their operation, and the latter from inconsistent access times and deterioration of performance at high injection rates. In this paper, we propose a transaction-less, time-division-based bus architecture, which dynamically allocates timeslots on-the-fly - the dTDMA bus. This architecture addresses the contention issues of current bus architectures, while avoiding the multi-hop overhead of NoC's. It is compared to traditional bus architectures and NoC's and shown to outperform both for configurations with fewer than 10 PE's. In order to exploit the advantages of the dTDMA bus for smaller configurations, and the scalability of NoC's, we propose a new hybrid SoC interconnect combining the two, showing significant improvement in both latency and power consumption.
AB - The two dominant architectural choices for implementing efficient communication fabrics for SoC's have been transaction-based buses and packet-based Networks-on-Chip (NoC). Both implementations have some inherent disadvantages - the former resulting from poor scalability and the transactional character of their operation, and the latter from inconsistent access times and deterioration of performance at high injection rates. In this paper, we propose a transaction-less, time-division-based bus architecture, which dynamically allocates timeslots on-the-fly - the dTDMA bus. This architecture addresses the contention issues of current bus architectures, while avoiding the multi-hop overhead of NoC's. It is compared to traditional bus architectures and NoC's and shown to outperform both for configurations with fewer than 10 PE's. In order to exploit the advantages of the dTDMA bus for smaller configurations, and the scalability of NoC's, we propose a new hybrid SoC interconnect combining the two, showing significant improvement in both latency and power consumption.
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U2 - 10.1109/VLSID.2006.10
DO - 10.1109/VLSID.2006.10
M3 - Conference contribution
AN - SCOPUS:33748554106
SN - 0769525024
SN - 9780769525020
T3 - Proceedings of the IEEE International Conference on VLSI Design
SP - 657
EP - 664
BT - Proceedings - 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design
T2 - 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design
Y2 - 3 January 2006 through 7 January 2006
ER -