TY - GEN
T1 - A low-cost approach for testing embedded RF Passive circuits based on oscillation principle
AU - Goyal, Abhilash
AU - Swaminathan, Madhavan
PY - 2008
Y1 - 2008
N2 - In this paper, a low-cost method for testing RF passive filters embedded in an RF substrate is proposed. As compared to a conventional test method the proposed method reduces the test-setup cost by around 35%. This method does not require any Vector Network Analyzer (VNA) and allows the testing of embedded RF filters without any external test stimulus. A calibration technique is presented for an efficient implementation of the proposed method at the production floor. The core principle of the method is to include embedded passive filters through substrate surface probes into an external RF amplifier located on the probe card, such that this inclusion causes the RF amplifier to oscillate. RF filters are tested by measuring the changes in the oscillation frequency of the proposed test-setup. Hence, the test-setup cost reduces substantially. The test method with the calibration technique is demonstrated by simulations and measurements.
AB - In this paper, a low-cost method for testing RF passive filters embedded in an RF substrate is proposed. As compared to a conventional test method the proposed method reduces the test-setup cost by around 35%. This method does not require any Vector Network Analyzer (VNA) and allows the testing of embedded RF filters without any external test stimulus. A calibration technique is presented for an efficient implementation of the proposed method at the production floor. The core principle of the method is to include embedded passive filters through substrate surface probes into an external RF amplifier located on the probe card, such that this inclusion causes the RF amplifier to oscillate. RF filters are tested by measuring the changes in the oscillation frequency of the proposed test-setup. Hence, the test-setup cost reduces substantially. The test method with the calibration technique is demonstrated by simulations and measurements.
UR - http://www.scopus.com/inward/record.url?scp=60649085619&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=60649085619&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2008.4736033
DO - 10.1109/EDAPS.2008.4736033
M3 - Conference contribution
AN - SCOPUS:60649085619
SN - 9781424426331
T3 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
SP - 194
EP - 197
BT - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
T2 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Y2 - 10 December 2008 through 12 December 2008
ER -