TY - GEN
T1 - A method for creating behavioral models of oscillators using augmented neural networks
AU - Yu, Huan
AU - Swaminathan, Madhavan
AU - Ji, Chuanyi
AU - White, David
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - This paper describes a novel technique to model the nonlinear time-domain behavior of oscillators using augmented neural networks. In the proposed method, a feed forward neural network with a periodic unit is used to capture the periodicity of the oscillatory output waveform. As opposed to the state space model, which is based on a system of differential equations, the output of the oscillator is generated explicitly using the neural network presented in this paper. The model is trained using the data obtained from the simulation of transistor-level circuit models. Examples applied to ring oscillators show the advantages using this method based on CPU time and accuracy. The proposed model is compatible with Verilog-A.
AB - This paper describes a novel technique to model the nonlinear time-domain behavior of oscillators using augmented neural networks. In the proposed method, a feed forward neural network with a periodic unit is used to capture the periodicity of the oscillatory output waveform. As opposed to the state space model, which is based on a system of differential equations, the output of the oscillator is generated explicitly using the neural network presented in this paper. The model is trained using the data obtained from the simulation of transistor-level circuit models. Examples applied to ring oscillators show the advantages using this method based on CPU time and accuracy. The proposed model is compatible with Verilog-A.
UR - http://www.scopus.com/inward/record.url?scp=85049728063&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85049728063&partnerID=8YFLogxK
U2 - 10.1109/EPEPS.2017.8329714
DO - 10.1109/EPEPS.2017.8329714
M3 - Conference contribution
AN - SCOPUS:85049728063
T3 - 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017
SP - 1
EP - 3
BT - 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 26th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017
Y2 - 15 October 2017 through 18 October 2017
ER -