A micro-contact and wear model for chemical-mechanical polishing of silicon wafers

Keyphrases

• Abrasive Wear 20%
• Applied Load 20%
• Chemical Action 20%
• Chemical Mechanical Polishing 100%
• Chemical Parameters 20%
• Close-form 20%
• Contact Mechanics 20%
• Contact Mechanism 20%
• Contact Model 100%
• Elastic-plastic 20%
• Geometric Parameters 20%
• Loading Rate 20%
• Material Geometry 20%
• Material Parameters 20%
• Material Removal Rate 20%
• Mechanical Action 20%
• Microcontact 100%
• Microwear 100%
• Operating Conditions 20%
• Operating Parameters 20%
• Operating Speed 20%
• Particle Concentration 20%
• Particle Size 20%
• Polishing Process 80%
• Removal Rate 40%
• Silicon Wafer 100%
• Slurry 60%
• Surface Hardness 20%
• Synergetic Effect 20%
• Wafer Surface 20%
• Wear Mechanism 20%
• Wear Model 100%
• Wear Theory 20%

Engineering

• Abrasive Wear 20%
• Applied Load 20%
• Chemical Action 20%
• Chemical Mechanical Polishing 100%
• Chemical Parameter 20%
• Contact Mechanics 20%
• Geometric Parameter 20%
• Good Agreement 20%
• Load Speed 20%
• Material Parameter 20%
• Material Removal Rate 20%
• Mechanical Action 20%
• Operating Parameter 20%
• Operating Speed 20%
• Particle Concentration 20%
• Polishing Process 80%
• Removal Rate 40%
• Silicon Wafer 100%
• Slurry Particle 20%

Material Science

• Abrasion 20%
• Chemical Mechanical Planarization 100%
• Contact Mechanics 20%
• Silicon Wafer 100%
• Slurry Particle 20%