TY - JOUR
T1 - A model based enterprise approach in electronics manufacturing
AU - Ozbolat, Ibrahim T.
AU - Dababneh, Amer
AU - Elgaali, Omer
AU - Zhang, Yahui
AU - Marler, Timothy
AU - Turek, Steven
N1 - Funding Information:
This work has been supported by Air Force Research Laboratory under the subcontract from South Caroline Research Authority 2011-215 with federal government contract number FA8650-08-C-5707. The authors would like to thank Matthew Denney, Ben Goerdt, Ross Johnson, Anith Mathai, Aidan Murphy and Nic Capdevilla from Center for Computer-aided Design for PREVIEW figures and acknowledge Rockwell Collins, Inc. for helpful suggestions and expert feedback. None of the authors have financial interest in the software PREVIEW.
PY - 2012
Y1 - 2012
N2 - Electromagnetic compatibility and overheating are two key issues in printed circuit board (PCB) manufacturing. Due to design and manufacturing limitations, the Department of Defense (DoD) suppliers put tremendous efforts on testing physical prototypes of PCBs. In this work, we developed a model-based interactive and 3D environment, the predictive environment for visualization of electromechanical virtual validation (PREVIEW), to test and analyze the virtual performance of PCBs, which aids designers assessing manufacturability of PCBs virtually prior to developing a physical prototype. Firstly, a thermal simulation module is developed and integrated into PREVIEW to analyze thermal performance of PCBs. Secondly; electromagnetic compatibility is visualized through simulation of 3D electromagnetic field and noise emission.
AB - Electromagnetic compatibility and overheating are two key issues in printed circuit board (PCB) manufacturing. Due to design and manufacturing limitations, the Department of Defense (DoD) suppliers put tremendous efforts on testing physical prototypes of PCBs. In this work, we developed a model-based interactive and 3D environment, the predictive environment for visualization of electromechanical virtual validation (PREVIEW), to test and analyze the virtual performance of PCBs, which aids designers assessing manufacturability of PCBs virtually prior to developing a physical prototype. Firstly, a thermal simulation module is developed and integrated into PREVIEW to analyze thermal performance of PCBs. Secondly; electromagnetic compatibility is visualized through simulation of 3D electromagnetic field and noise emission.
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U2 - 10.3722/cadaps.2012.847-856
DO - 10.3722/cadaps.2012.847-856
M3 - Article
AN - SCOPUS:84864382312
SN - 1686-4360
VL - 9
SP - 847
EP - 856
JO - Computer-Aided Design and Applications
JF - Computer-Aided Design and Applications
IS - 6
ER -
