A model based enterprise approach in electronics manufacturing

Ibrahim T. Ozbolat; Amer Dababneh; Omer Elgaali; Yahui Zhang; Timothy Marler; Steven Turek

doi:10.3722/cadaps.2012.847-856

A model based enterprise approach in electronics manufacturing

Ibrahim T. Ozbolat
, Amer Dababneh
, Omer Elgaali
, Yahui Zhang
, Timothy Marler
, Steven Turek

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

Electromagnetic compatibility and overheating are two key issues in printed circuit board (PCB) manufacturing. Due to design and manufacturing limitations, the Department of Defense (DoD) suppliers put tremendous efforts on testing physical prototypes of PCBs. In this work, we developed a model-based interactive and 3D environment, the predictive environment for visualization of electromechanical virtual validation (PREVIEW), to test and analyze the virtual performance of PCBs, which aids designers assessing manufacturability of PCBs virtually prior to developing a physical prototype. Firstly, a thermal simulation module is developed and integrated into PREVIEW to analyze thermal performance of PCBs. Secondly; electromagnetic compatibility is visualized through simulation of 3D electromagnetic field and noise emission.

Original language	English (US)
Pages (from-to)	847-856
Number of pages	10
Journal	Computer-Aided Design and Applications
Volume	9
Issue number	6
DOIs	https://doi.org/10.3722/cadaps.2012.847-856
State	Published - 2012

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 3 Good Health and Well-being

All Science Journal Classification (ASJC) codes

Computational Mechanics
Computer Graphics and Computer-Aided Design
Computational Mathematics

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10.3722/cadaps.2012.847-856

Cite this

@article{30b8440da81849d0aa0fed1c3bf1e83e,

title = "A model based enterprise approach in electronics manufacturing",

abstract = "Electromagnetic compatibility and overheating are two key issues in printed circuit board (PCB) manufacturing. Due to design and manufacturing limitations, the Department of Defense (DoD) suppliers put tremendous efforts on testing physical prototypes of PCBs. In this work, we developed a model-based interactive and 3D environment, the predictive environment for visualization of electromechanical virtual validation (PREVIEW), to test and analyze the virtual performance of PCBs, which aids designers assessing manufacturability of PCBs virtually prior to developing a physical prototype. Firstly, a thermal simulation module is developed and integrated into PREVIEW to analyze thermal performance of PCBs. Secondly; electromagnetic compatibility is visualized through simulation of 3D electromagnetic field and noise emission.",

author = "Ozbolat, \{Ibrahim T.\} and Amer Dababneh and Omer Elgaali and Yahui Zhang and Timothy Marler and Steven Turek",

note = "Funding Information: This work has been supported by Air Force Research Laboratory under the subcontract from South Caroline Research Authority 2011-215 with federal government contract number FA8650-08-C-5707. The authors would like to thank Matthew Denney, Ben Goerdt, Ross Johnson, Anith Mathai, Aidan Murphy and Nic Capdevilla from Center for Computer-aided Design for PREVIEW figures and acknowledge Rockwell Collins, Inc. for helpful suggestions and expert feedback. None of the authors have financial interest in the software PREVIEW.",

year = "2012",

doi = "10.3722/cadaps.2012.847-856",

language = "English (US)",

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}

TY - JOUR

T1 - A model based enterprise approach in electronics manufacturing

AU - Ozbolat, Ibrahim T.

AU - Dababneh, Amer

AU - Elgaali, Omer

AU - Zhang, Yahui

AU - Marler, Timothy

AU - Turek, Steven

N1 - Funding Information: This work has been supported by Air Force Research Laboratory under the subcontract from South Caroline Research Authority 2011-215 with federal government contract number FA8650-08-C-5707. The authors would like to thank Matthew Denney, Ben Goerdt, Ross Johnson, Anith Mathai, Aidan Murphy and Nic Capdevilla from Center for Computer-aided Design for PREVIEW figures and acknowledge Rockwell Collins, Inc. for helpful suggestions and expert feedback. None of the authors have financial interest in the software PREVIEW.

PY - 2012

Y1 - 2012

N2 - Electromagnetic compatibility and overheating are two key issues in printed circuit board (PCB) manufacturing. Due to design and manufacturing limitations, the Department of Defense (DoD) suppliers put tremendous efforts on testing physical prototypes of PCBs. In this work, we developed a model-based interactive and 3D environment, the predictive environment for visualization of electromechanical virtual validation (PREVIEW), to test and analyze the virtual performance of PCBs, which aids designers assessing manufacturability of PCBs virtually prior to developing a physical prototype. Firstly, a thermal simulation module is developed and integrated into PREVIEW to analyze thermal performance of PCBs. Secondly; electromagnetic compatibility is visualized through simulation of 3D electromagnetic field and noise emission.

AB - Electromagnetic compatibility and overheating are two key issues in printed circuit board (PCB) manufacturing. Due to design and manufacturing limitations, the Department of Defense (DoD) suppliers put tremendous efforts on testing physical prototypes of PCBs. In this work, we developed a model-based interactive and 3D environment, the predictive environment for visualization of electromechanical virtual validation (PREVIEW), to test and analyze the virtual performance of PCBs, which aids designers assessing manufacturability of PCBs virtually prior to developing a physical prototype. Firstly, a thermal simulation module is developed and integrated into PREVIEW to analyze thermal performance of PCBs. Secondly; electromagnetic compatibility is visualized through simulation of 3D electromagnetic field and noise emission.

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UR - https://www.scopus.com/pages/publications/84864382312#tab=citedBy

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DO - 10.3722/cadaps.2012.847-856

M3 - Article

AN - SCOPUS:84864382312

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SP - 847

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JO - Computer-Aided Design and Applications

JF - Computer-Aided Design and Applications

IS - 6

ER -

A model based enterprise approach in electronics manufacturing

Abstract

UN SDGs

All Science Journal Classification (ASJC) codes

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