A molecular dynamics study for stability of thin water films on nanostructured surfaces

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The stability of thin water films on a variety of gold nanostructures was simulated by molecular dynamics simulations. The critical film thickness to prevent a film breakup was investigated as a function of the characteristic length of the nanostructures. Layering of water molecules adjacent to the gold substrate was observed as a result of the strong van der Waals interactions between the water molecules and the gold atoms. A model for the critical film thickness in the presence of nanostructures is developed based on the stability analysis. The model prediction is compared with molecular dynamics simulations with good agreement.

Original languageEnglish (US)
Title of host publicationASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791856871
DOIs
StatePublished - 2015
EventASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, United States
Duration: Jul 6 2015Jul 9 2015

Publication series

NameASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Other

OtherASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Country/TerritoryUnited States
CitySan Francisco
Period7/6/157/9/15

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology

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