TY - GEN
T1 - A new approach to power integrity with thinfilm capacitors in 3D IPAC functional module
AU - Gandhi, Saumya
AU - Raj, P. Markondeya
AU - Sundaram, Venky
AU - Sharma, Himani
AU - Swaminathan, Madhavan
AU - Tummala, Rao
PY - 2013
Y1 - 2013
N2 - This paper presents a new active and passive integration concept called 3D IPAC (Integrated Actives and Passives) to address the power integrity in high-performance and multifunctional systems. The 3D IPAC consists of an ultra-thin glass module with through-vias and double-side integration of ultra-thin active and passive components to form functional modules. By integrating power ICs, storage capacitors and inductors, and high-frequency decoupling capacitors in ultra-thin (30-100 μm) glass substrates, 3D IPAC Voltage Regulator Module (3D IPAC VRM) provides a complete and ultra-miniaturized solution to power integrity. The ultra-thin 3D IPAC allows both actives and passives very close to each other and to the other active dies, resulting in improved performance over conventional SMDs and state-of-art IPDs for decoupling functions. The first part of the paper presents modeling results to show the benefits of the 3D IPAC module as a power integrity solution. The second part of the paper presents the fabrication and characterization of high-k thinfilm capacitors and etched aluminum film capacitors integrated on either sides of a through-via 3D IPAC glass substrate. This paper, therefore, demonstrates the integration of heterogeneous capacitors on a single ultra-thin glass substrate for the first time, and presents its benefits as a complete solution for power integrity.
AB - This paper presents a new active and passive integration concept called 3D IPAC (Integrated Actives and Passives) to address the power integrity in high-performance and multifunctional systems. The 3D IPAC consists of an ultra-thin glass module with through-vias and double-side integration of ultra-thin active and passive components to form functional modules. By integrating power ICs, storage capacitors and inductors, and high-frequency decoupling capacitors in ultra-thin (30-100 μm) glass substrates, 3D IPAC Voltage Regulator Module (3D IPAC VRM) provides a complete and ultra-miniaturized solution to power integrity. The ultra-thin 3D IPAC allows both actives and passives very close to each other and to the other active dies, resulting in improved performance over conventional SMDs and state-of-art IPDs for decoupling functions. The first part of the paper presents modeling results to show the benefits of the 3D IPAC module as a power integrity solution. The second part of the paper presents the fabrication and characterization of high-k thinfilm capacitors and etched aluminum film capacitors integrated on either sides of a through-via 3D IPAC glass substrate. This paper, therefore, demonstrates the integration of heterogeneous capacitors on a single ultra-thin glass substrate for the first time, and presents its benefits as a complete solution for power integrity.
UR - http://www.scopus.com/inward/record.url?scp=84883378800&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84883378800&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2013.6575727
DO - 10.1109/ECTC.2013.6575727
M3 - Conference contribution
AN - SCOPUS:84883378800
SN - 9781479902330
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1197
EP - 1203
BT - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
T2 - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Y2 - 28 May 2013 through 31 May 2013
ER -