A novel fabrication method for embedding metal structures into polymers for flexible electronics

A novel and simple technique for the surface integration of metal structures into polymers (SIMSIP) is presented. The key to this process is the use of a chemically inert, ultra-smooth "mother substrate" such as quartz or Teflon. Metal is deposited on the mother substrate, interconnect and electrode structures are defined by lift-off, and the polymer is deposited. The process has been used to successfully embed micro-metal structures of Au, Ag, and Cu into polyimide films without affecting the functional properties of the either the metals or the polymer. Current process capabilities support the surface-embedding of metal structures as narrow 2μm in width and with different geometries commonly used in circuit design. Although a variety of approaches exist in literature for applying metals to polymers, the proposed methodology provides a more robust, simpler, and more reliable way of achieving flexible circuits/electronics in thin films that would also be suitable for high volume manufacturing. The proposed methodology offers an alternative approach to the fabrication of interconnects and electrodes on polymers for flexible electronics applications such as flexible antennas, displays, sensor arrays, and e-skin.