TY - GEN
T1 - A novel method for suppression of vertical coupling in multi-layered substrates
AU - Sankaran, Nithya
AU - Swaminathan, Madhavan
AU - Tummala, Rao
PY - 2008
Y1 - 2008
N2 - This paper demonstrates the suppression of vertical coupling between multiple plane pairs in GHz range of frequencies with Electromagnetic Band-Gap structures (EBGs). For the first time, dispersion diagrams have been developed for the EBGs used in vertical isolation giving insight into the coupling suppression. Results from simulations, measurements and analytical methods are presented to demonstrate the proposed method.
AB - This paper demonstrates the suppression of vertical coupling between multiple plane pairs in GHz range of frequencies with Electromagnetic Band-Gap structures (EBGs). For the first time, dispersion diagrams have been developed for the EBGs used in vertical isolation giving insight into the coupling suppression. Results from simulations, measurements and analytical methods are presented to demonstrate the proposed method.
UR - http://www.scopus.com/inward/record.url?scp=60649116974&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=60649116974&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2008.4736015
DO - 10.1109/EDAPS.2008.4736015
M3 - Conference contribution
AN - SCOPUS:60649116974
SN - 9781424426331
T3 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
SP - 124
EP - 127
BT - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
T2 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Y2 - 10 December 2008 through 12 December 2008
ER -