A novel methodology for 3D integration using multilayer organics

G. White; S. Dalmia; L. Carastro; V. Govind; C. Russell; V. Sundaram; M. Swaminathan

A novel methodology for 3D integration using multilayer organics

G. White, S. Dalmia, L. Carastro, V. Govind, C. Russell, V. Sundaram, M. Swaminathan

Electrical Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract

This paper presents for the first time a new paradigm in the construction of multilayer RF, digital and mixed signal circuits using a patented process developed at Jacket Micro Devices. The new process termed Low Temperature Laminated Organics, LTLO [1], is a multilayer parallel process where individual layers are circuitized, tested and co-laminated at temperatures below 280oC to form a multilayer structure. Both stacked and staggered via structures have been realized with LTLO, thereby allowing for the realization of any layer, any via interconnection schemes. The LTLO technology also facilitates the introduction of embedded active and passive component allowing for true 3D package integration. To date up to 24 metal layers have been demonstrated using LTLO.

Original language	English (US)
Pages	331-336
Number of pages	6
State	Published - 2008
Event	IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008 - Scottsdale, AZ, United States Duration: Mar 17 2008 → Mar 17 2008

Other

Other	IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008
Country/Territory	United States
City	Scottsdale, AZ
Period	3/17/08 → 3/17/08

All Science Journal Classification (ASJC) codes

Surfaces, Coatings and Films

Cite this

White, G., Dalmia, S., Carastro, L., Govind, V., Russell, C., Sundaram, V., & Swaminathan, M. (2008). A novel methodology for 3D integration using multilayer organics. 331-336. Paper presented at IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008, Scottsdale, AZ, United States.

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title = "A novel methodology for 3D integration using multilayer organics",

abstract = "This paper presents for the first time a new paradigm in the construction of multilayer RF, digital and mixed signal circuits using a patented process developed at Jacket Micro Devices. The new process termed Low Temperature Laminated Organics, LTLO [1], is a multilayer parallel process where individual layers are circuitized, tested and co-laminated at temperatures below 280oC to form a multilayer structure. Both stacked and staggered via structures have been realized with LTLO, thereby allowing for the realization of any layer, any via interconnection schemes. The LTLO technology also facilitates the introduction of embedded active and passive component allowing for true 3D package integration. To date up to 24 metal layers have been demonstrated using LTLO.",

author = "G. White and S. Dalmia and L. Carastro and V. Govind and C. Russell and V. Sundaram and M. Swaminathan",

year = "2008",

language = "English (US)",

pages = "331--336",

note = "IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008 ; Conference date: 17-03-2008 Through 17-03-2008",

}

White, G, Dalmia, S, Carastro, L, Govind, V, Russell, C, Sundaram, V & Swaminathan, M 2008, 'A novel methodology for 3D integration using multilayer organics', Paper presented at IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008, Scottsdale, AZ, United States, 3/17/08 - 3/17/08 pp. 331-336.

A novel methodology for 3D integration using multilayer organics. / White, G.; Dalmia, S.; Carastro, L. et al.
2008. 331-336 Paper presented at IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008, Scottsdale, AZ, United States.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - A novel methodology for 3D integration using multilayer organics

AU - White, G.

AU - Dalmia, S.

AU - Carastro, L.

AU - Govind, V.

AU - Russell, C.

AU - Sundaram, V.

AU - Swaminathan, M.

PY - 2008

Y1 - 2008

N2 - This paper presents for the first time a new paradigm in the construction of multilayer RF, digital and mixed signal circuits using a patented process developed at Jacket Micro Devices. The new process termed Low Temperature Laminated Organics, LTLO [1], is a multilayer parallel process where individual layers are circuitized, tested and co-laminated at temperatures below 280oC to form a multilayer structure. Both stacked and staggered via structures have been realized with LTLO, thereby allowing for the realization of any layer, any via interconnection schemes. The LTLO technology also facilitates the introduction of embedded active and passive component allowing for true 3D package integration. To date up to 24 metal layers have been demonstrated using LTLO.

AB - This paper presents for the first time a new paradigm in the construction of multilayer RF, digital and mixed signal circuits using a patented process developed at Jacket Micro Devices. The new process termed Low Temperature Laminated Organics, LTLO [1], is a multilayer parallel process where individual layers are circuitized, tested and co-laminated at temperatures below 280oC to form a multilayer structure. Both stacked and staggered via structures have been realized with LTLO, thereby allowing for the realization of any layer, any via interconnection schemes. The LTLO technology also facilitates the introduction of embedded active and passive component allowing for true 3D package integration. To date up to 24 metal layers have been demonstrated using LTLO.

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M3 - Paper

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EP - 336

T2 - IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008

Y2 - 17 March 2008 through 17 March 2008

ER -

A novel methodology for 3D integration using multilayer organics

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All Science Journal Classification (ASJC) codes

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