This paper presents for the first time a new paradigm in the construction of multilayer RF, digital and mixed signal circuits using conventional low-loss organic laminates. The new process termed Low Temperature Laminated Organics, LTLO™ , is a multilayer parallel process where individual layers are circuitized, tested and co-laminated at temperatures below 280°C to form a multilayer structure. Both stacked and staggered via structures have been realized with LTLO, thereby allowing for the realization of any layer, and any via interconnection schemes. The LTLO technology also facilitates the introduction of embedded active and passive components allowing for true 3D package integration. To date up to 24 metal layers have been demonstrated using LTLO.