A novel methodology (low temperature laminated organics) for 3D integration using multilayer organics

G. White; S. Dalmia; L. Carastro; C. Russell; V. Sundaram; M. Swaminathan

doi:10.1109/ECTC.2008.4549947

A novel methodology (low temperature laminated organics) for 3D integration using multilayer organics

G. White, S. Dalmia, L. Carastro, C. Russell, V. Sundaram, M. Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents for the first time a new paradigm in the construction of multilayer RF, digital and mixed signal circuits using conventional low-loss organic laminates. The new process termed Low Temperature Laminated Organics, LTLO™ [1], is a multilayer parallel process where individual layers are circuitized, tested and co-laminated at temperatures below 280°C to form a multilayer structure. Both stacked and staggered via structures have been realized with LTLO, thereby allowing for the realization of any layer, and any via interconnection schemes. The LTLO technology also facilitates the introduction of embedded active and passive components allowing for true 3D package integration. To date up to 24 metal layers have been demonstrated using LTLO.

Original language	English (US)
Title of host publication	2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages	34-37
Number of pages	4
DOIs	https://doi.org/10.1109/ECTC.2008.4549947
State	Published - 2008
Event	2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States Duration: May 27 2008 → May 30 2008

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	2008 58th Electronic Components and Technology Conference, ECTC
Country/Territory	United States
City	Lake Buena Vista, FL
Period	5/27/08 → 5/30/08

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2008.4549947

Cite this

White, G., Dalmia, S., Carastro, L., Russell, C., Sundaram, V., & Swaminathan, M. (2008). A novel methodology (low temperature laminated organics) for 3D integration using multilayer organics. In 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC (pp. 34-37). Article 4549947 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2008.4549947

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title = "A novel methodology (low temperature laminated organics) for 3D integration using multilayer organics",

abstract = "This paper presents for the first time a new paradigm in the construction of multilayer RF, digital and mixed signal circuits using conventional low-loss organic laminates. The new process termed Low Temperature Laminated Organics, LTLO{\texttrademark} [1], is a multilayer parallel process where individual layers are circuitized, tested and co-laminated at temperatures below 280°C to form a multilayer structure. Both stacked and staggered via structures have been realized with LTLO, thereby allowing for the realization of any layer, and any via interconnection schemes. The LTLO technology also facilitates the introduction of embedded active and passive components allowing for true 3D package integration. To date up to 24 metal layers have been demonstrated using LTLO.",

author = "G. White and S. Dalmia and L. Carastro and C. Russell and V. Sundaram and M. Swaminathan",

year = "2008",

doi = "10.1109/ECTC.2008.4549947",

language = "English (US)",

isbn = "9781424422302",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "34--37",

booktitle = "2008 Proceedings 58th Electronic Components and Technology Conference, ECTC",

note = "2008 58th Electronic Components and Technology Conference, ECTC ; Conference date: 27-05-2008 Through 30-05-2008",

}

White, G, Dalmia, S, Carastro, L, Russell, C, Sundaram, V & Swaminathan, M 2008, A novel methodology (low temperature laminated organics) for 3D integration using multilayer organics. in 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC., 4549947, Proceedings - Electronic Components and Technology Conference, pp. 34-37, 2008 58th Electronic Components and Technology Conference, ECTC, Lake Buena Vista, FL, United States, 5/27/08. https://doi.org/10.1109/ECTC.2008.4549947

A novel methodology (low temperature laminated organics) for 3D integration using multilayer organics. / White, G.; Dalmia, S.; Carastro, L. et al.
2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. 2008. p. 34-37 4549947 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - This paper presents for the first time a new paradigm in the construction of multilayer RF, digital and mixed signal circuits using conventional low-loss organic laminates. The new process termed Low Temperature Laminated Organics, LTLO™ [1], is a multilayer parallel process where individual layers are circuitized, tested and co-laminated at temperatures below 280°C to form a multilayer structure. Both stacked and staggered via structures have been realized with LTLO, thereby allowing for the realization of any layer, and any via interconnection schemes. The LTLO technology also facilitates the introduction of embedded active and passive components allowing for true 3D package integration. To date up to 24 metal layers have been demonstrated using LTLO.

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White G, Dalmia S, Carastro L, Russell C, Sundaram V, Swaminathan M. A novel methodology (low temperature laminated organics) for 3D integration using multilayer organics. In 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. 2008. p. 34-37. 4549947. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2008.4549947

A novel methodology (low temperature laminated organics) for 3D integration using multilayer organics

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