Abstract
This article presents the design and implementation of a feedback LC oscillator in a novel multilayer laminate-type process technology that uses multiple layers of liquid crystalline polymer (LCP) substrate. The 1.8-GHz oscillator is designed using high-quality-factor (Q) lumped-element passives that are embedded in the LCP substrate. The oscillator was fabricated on a large area, high Q integrated process technology employing six metal layers with an overall height (thickness) of 0.7 mm. The microstrip-type oscillator utilizes silicon bipolar device technology and measures a phase noise of -117 dBc/Hz at 100-KHz offset. Including the output buffer, the fully packaged oscillator occupies an area of 5.3 × 4.8 mm2 and, under steady state, the oscillator consumes 10 mW from a 2.7-V power supply.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 227-237 |
| Number of pages | 11 |
| Journal | International Journal of RF and Microwave Computer-Aided Engineering |
| Volume | 16 |
| Issue number | 3 |
| DOIs | |
| State | Published - May 2006 |
All Science Journal Classification (ASJC) codes
- Computer Science Applications
- Computer Graphics and Computer-Aided Design
- Electrical and Electronic Engineering