A novel technique for analyzing periodic structures in high speed electronic packaging

M. Swaminathan; P. Petre

doi:10.1109/EPEP.1993.394594

A novel technique for analyzing periodic structures in high speed electronic packaging

M. Swaminathan, P. Petre

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A technique is presented to accurately characterize periodic structures in high-speed electronic packages. A single algorithm can be used to compute the radiation from or propagation on periodic structures by varying the angle of the incident wave. The algorithm has a wide application ranging from electromagnetic interference (EMI) to wave transmission in electronic packages. Details on the formulation, application to wave propagation, results and an extension to the use of the method for analysis of scattering from periodic structures are presented.

Original language	English (US)
Title of host publication	IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	43-46
Number of pages	4
ISBN (Electronic)	0780314271, 9780780314276
DOIs	https://doi.org/10.1109/EPEP.1993.394594
State	Published - 1993
Event	2nd IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993 - Monterey, United States Duration: Oct 20 1993 → Oct 22 1993

Publication series

Name	IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993

Conference

Conference	2nd IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993
Country/Territory	United States
City	Monterey
Period	10/20/93 → 10/22/93

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

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10.1109/EPEP.1993.394594

Cite this

Swaminathan, M., & Petre, P. (1993). A novel technique for analyzing periodic structures in high speed electronic packaging. In IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993 (pp. 43-46). Article 394594 (IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.1993.394594

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title = "A novel technique for analyzing periodic structures in high speed electronic packaging",

abstract = "A technique is presented to accurately characterize periodic structures in high-speed electronic packages. A single algorithm can be used to compute the radiation from or propagation on periodic structures by varying the angle of the incident wave. The algorithm has a wide application ranging from electromagnetic interference (EMI) to wave transmission in electronic packages. Details on the formulation, application to wave propagation, results and an extension to the use of the method for analysis of scattering from periodic structures are presented.",

author = "M. Swaminathan and P. Petre",

note = "Publisher Copyright: {\textcopyright} 1993 IEEE.; 2nd IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993 ; Conference date: 20-10-1993 Through 22-10-1993",

year = "1993",

doi = "10.1109/EPEP.1993.394594",

language = "English (US)",

series = "IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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booktitle = "IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993",

address = "United States",

}

Swaminathan, M & Petre, P 1993, A novel technique for analyzing periodic structures in high speed electronic packaging. in IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993., 394594, IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993, Institute of Electrical and Electronics Engineers Inc., pp. 43-46, 2nd IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993, Monterey, United States, 10/20/93. https://doi.org/10.1109/EPEP.1993.394594

A novel technique for analyzing periodic structures in high speed electronic packaging. / Swaminathan, M.; Petre, P.
IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993. Institute of Electrical and Electronics Engineers Inc., 1993. p. 43-46 394594 (IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - A technique is presented to accurately characterize periodic structures in high-speed electronic packages. A single algorithm can be used to compute the radiation from or propagation on periodic structures by varying the angle of the incident wave. The algorithm has a wide application ranging from electromagnetic interference (EMI) to wave transmission in electronic packages. Details on the formulation, application to wave propagation, results and an extension to the use of the method for analysis of scattering from periodic structures are presented.

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BT - IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993

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Swaminathan M, Petre P. A novel technique for analyzing periodic structures in high speed electronic packaging. In IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993. Institute of Electrical and Electronics Engineers Inc. 1993. p. 43-46. 394594. (IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993). doi: 10.1109/EPEP.1993.394594

A novel technique for analyzing periodic structures in high speed electronic packaging

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