A Passive Equalizer Design for Shielded Differential Through-Silicon Vias in 3-D IC

Kai Fu, Wen Sheng Zhao, Gaofeng Wang, Madhavan Swaminathan

Research output: Contribution to journalArticlepeer-review

11 Scopus citations

Abstract

This letter develops a simplified circuit model for the shielded differential through-silicon vias (SD-TSVs). The model is consisted of four frequency-independent elements and can accurately predict the insertion loss of the SD-TSVs up to 20 GHz. Based on the model, a parallel resistor-capacitor equalizer is proposed. The proposed passive equalizer achieves wide-band equalization and perfect compensation for high-speed differential signaling.

Original languageEnglish (US)
Article number8418682
Pages (from-to)768-770
Number of pages3
JournalIEEE Microwave and Wireless Components Letters
Volume28
Issue number9
DOIs
StatePublished - Sep 2018

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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