@article{ab53819f29234a4eaa31c945c6cd7758,
title = "A Passive Equalizer Design for Shielded Differential Through-Silicon Vias in 3-D IC",
abstract = "This letter develops a simplified circuit model for the shielded differential through-silicon vias (SD-TSVs). The model is consisted of four frequency-independent elements and can accurately predict the insertion loss of the SD-TSVs up to 20 GHz. Based on the model, a parallel resistor-capacitor equalizer is proposed. The proposed passive equalizer achieves wide-band equalization and perfect compensation for high-speed differential signaling.",
author = "Kai Fu and Zhao, {Wen Sheng} and Gaofeng Wang and Madhavan Swaminathan",
note = "Funding Information: Manuscript received June 14, 2018; accepted July 4, 2018. Date of publication July 24, 2018; date of current version September 4, 2018. This work was supported in part by the National Natural Science Foundation of China under Grant 61504033 and Grant 61411136003, in part by the Talent Project of Zhejiang Association for Science and Technology under Grant 2017YCGC012, and in part by the Open Research Fund of Key Lab of Millimeter Waves, Southeast University under Grant K201910. (Corresponding author: Wen-Sheng Zhao.) K. Fu and G. Wang are with the Key Laboratory of RF Circuits and Systems of Ministry of Education, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, China. Publisher Copyright: {\textcopyright} 2018 IEEE.",
year = "2018",
month = sep,
doi = "10.1109/LMWC.2018.2854552",
language = "English (US)",
volume = "28",
pages = "768--770",
journal = "IEEE Microwave and Wireless Components Letters",
issn = "1531-1309",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "9",
}