A pixel-pitch-matched ultrasound receiver for 3D photoacoustic imaging with integrated delta-sigma beamformer in 28nm UTBB FDSOI

Man Chia Chen, Aldo Peña Perez, Sri Rajasekhar Kothapalli, Philippe Cathelin, Andreia Cathelin, Sanjiv Sam Gambhir, Boris Murmann

Research output: Chapter in Book/Report/Conference proceedingConference contribution

19 Scopus citations

Abstract

A variety of emerging applications in medical ultrasound rely on 3D volumetric imaging, calling for dense 2D transducer arrays with thousands of elements. Due to this high channel count, the traditional per-element cable interface used for 1D arrays is no longer viable. To address this issue, recent work has proven the viability of flip-chip bonding [1] or direct transducer integration [2]. This shifts the burden to a CMOS substrate, which must provide dense signal conditioning and processing before the massively parallel image data can be pushed off chip. A common approach for data reduction is to employ subarray beamforming (BF), which applies delay and sum operations within a group of pixels. To implement such functionality within the tight pixel pitch, prior works have implemented the delays using simple S/H circuits [2] or analog filters [3], and typically suffer from a combination of issues related to limited delay, coarse delay resolution and limited SNR.

Original languageEnglish (US)
Title of host publication2017 IEEE International Solid-State Circuits Conference, ISSCC 2017
EditorsLaura C. Fujino
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages456-457
Number of pages2
ISBN (Electronic)9781509037575
DOIs
StatePublished - Mar 2 2017
Event64th IEEE International Solid-State Circuits Conference, ISSCC 2017 - San Francisco, United States
Duration: Feb 5 2017Feb 9 2017

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume60
ISSN (Print)0193-6530

Other

Other64th IEEE International Solid-State Circuits Conference, ISSCC 2017
Country/TerritoryUnited States
CitySan Francisco
Period2/5/172/9/17

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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