Skip to main navigation Skip to search Skip to main content

A rigorous model for through-silicon vias with ohmic contact in silicon interposer

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'A rigorous model for through-silicon vias with ohmic contact in silicon interposer'. Together they form a unique fingerprint.
Sort by

Keyphrases

Engineering

Computer Science