A study of material removal rates for shallow drilling with an ultrashort pulse laser

B. R. Campbell; L. A. Forster; J. A. Moore; T. M. Lehecka; J. G. Thomas; V. V. Semak

doi:10.1117/12.810173

A study of material removal rates for shallow drilling with an ultrashort pulse laser

B. R. Campbell, L. A. Forster, J. A. Moore, T. M. Lehecka, J. G. Thomas, V. V. Semak

Applied Research Laboratory (ARL)

Research output: Contribution to journal › Conference article › peer-review

1 Scopus citations

Abstract

Using a commercial laser system operating at a 532 nm wavelength with 10 ps pulses, experiments were conducted on polished metal samples to study material removal characteristics from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of energy and various double pulse machining methods were examined. The results from changing the pulse separation for double pulse drilling are compared to prior work with picosecond and nanosecond pulse lasers.

Original language	English (US)
Article number	72010I
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	7201
DOIs	https://doi.org/10.1117/12.810173
State	Published - May 27 2009
Event	Laser Applications in Microelectronic and Optoelectronic Manufacturing VII - San Jose, CA, United States Duration: Jan 26 2009 → Jan 29 2009

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.810173

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abstract = "Using a commercial laser system operating at a 532 nm wavelength with 10 ps pulses, experiments were conducted on polished metal samples to study material removal characteristics from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of energy and various double pulse machining methods were examined. The results from changing the pulse separation for double pulse drilling are compared to prior work with picosecond and nanosecond pulse lasers.",

author = "Campbell, {B. R.} and Forster, {L. A.} and Moore, {J. A.} and Lehecka, {T. M.} and Thomas, {J. G.} and Semak, {V. V.}",

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AU - Campbell, B. R.

AU - Forster, L. A.

AU - Moore, J. A.

AU - Lehecka, T. M.

AU - Thomas, J. G.

AU - Semak, V. V.

PY - 2009/5/27

Y1 - 2009/5/27

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AB - Using a commercial laser system operating at a 532 nm wavelength with 10 ps pulses, experiments were conducted on polished metal samples to study material removal characteristics from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of energy and various double pulse machining methods were examined. The results from changing the pulse separation for double pulse drilling are compared to prior work with picosecond and nanosecond pulse lasers.

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JF - Proceedings of SPIE - The International Society for Optical Engineering

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T2 - Laser Applications in Microelectronic and Optoelectronic Manufacturing VII

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ER -

A study of material removal rates for shallow drilling with an ultrashort pulse laser

Abstract

All Science Journal Classification (ASJC) codes

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