Abstract
This paper provides a survey of MCM substrate test techniques. Test techniques that are based on capacitance, resistance, electron beam, latent opens, time domain network analysis (TDNA) and RF resonator are discussed. In this paper, test techniques are applied to interconnect testing.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 27-38 |
| Number of pages | 12 |
| Journal | Journal of Electronic Testing: Theory and Applications (JETTA) |
| Volume | 10 |
| Issue number | 1-2 |
| DOIs | |
| State | Published - 1997 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
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