A three-terminal dual-pillar STT-MRAM for high-performance robust memory applications

Niladri Narayan Mojumder, Sumeet Kumar Gupta, Sri Harsha Choday, Dmitri E. Nikonov, Kaushik Roy

Research output: Contribution to journalArticlepeer-review

35 Scopus citations


The design of a three-terminal self-aligned dual-pillar (DP) magnetic tunnel junction (MTJ) utilizing both current-induced spin-transfer torque (STT) and magnetic domain-wall motion effects is proposed for high-speed nonvolatile robust memory applications. The choice of a thin tunneling oxide (∼0.9 nm) in a write-in port, spatially and electrically separated from a read-out port incorporating a thicker (∼1.8 nm) oxide on an extended thin-film multilayer stack, significantly improves the overall cell stability and parametric process yield of a memory array. A dual-bit-line memory architecture incorporating a single-ended voltage-sensing scheme for fast data readout with just one access transistor per cell is also proposed for the first time. The technologycircuit cooptimization of the proposed single-transistor (1T) DP STT magnetic random access memory (MRAM) cell is carried out using effective mass-based transport simulations in nonequilibrium Green's function formalism and accurate micromagnetic simulations involving the LandauLifshitzGilbertSlonczewski equation. The proposed DP STT-MRAM bit cell outperforms a state-of-the-art 1T1MTJ STT-MRAM cell in terms of higher cell tunneling magnetoresistance, simplified memory array architecture with a single supply for read/write, and significantly lower probability of disturb and access failures under parametric process variations with a marginal increase in critical switching current.

Original languageEnglish (US)
Article number5739108
Pages (from-to)1508-1516
Number of pages9
JournalIEEE Transactions on Electron Devices
Issue number5
StatePublished - May 2011

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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