Advanced Low-Loss Photo-imageable Dielectric Material for RF/Millimeter-Wave Applications and Demonstration of High-Density Interconnect

Kimiyuki Kanno, Hirokazu Ito, Taku Ogawa, Ryoji Tatara, Koichi Hasegawa, Atom Watanabe, Lakshmi Narasimha Vijay Kumar, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

The significance of low-loss dielectric materials becomes more remarkable for high-performance and miniaturized 5G-millimeter-wave packages. Among a wide variety of dielectric materials, low-loss photo-imageable dielectric (PID) is drawing attention because of the unique properties such as patternability and process simplicity. This paper introduces a new advanced low-loss PID material with low dielectric constant and low dissipation factor. The material also provides sub-10 μm photo-patterning using a standard photolithography process. It also offers superior mechanical properties over the previously-reported PID. The new material shows an elongation of 70%, a tensile strength of 120 MPa, a glass transition temperature of 200°C, and high adhesion to metal trace (5 N/cm) with smooth surface (Rq < 10 nm). To show the capability of multi-layer patterning with sub-40-µm photo-patterned microvias, daisy-chain structures are fabricated. This paper also discusses the surface roughness impact on signal losses in mm-wave frequency band (10 - 40 GHz). The results indicate that the mitigated surface roughness of this proposed material minimizes signal losses with precise re-distribution layer patterning.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages544-549
Number of pages6
ISBN (Electronic)9780738145235
DOIs
StatePublished - 2021
Event71st IEEE Electronic Components and Technology Conference, ECTC 2021 - Virtual, Online, United States
Duration: Jun 1 2021Jul 4 2021

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2021-June
ISSN (Print)0569-5503

Conference

Conference71st IEEE Electronic Components and Technology Conference, ECTC 2021
Country/TerritoryUnited States
CityVirtual, Online
Period6/1/217/4/21

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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