TY - GEN
T1 - Advanced polymers for advanced RF packaging applications
AU - Swaminathan, Madhavan
AU - Altunyurt, Nevin
AU - Hwang, Seunghyun
PY - 2010
Y1 - 2010
N2 - This paper presents advanced polymers for RF packaging applications including filters and antennas. First, micro-scaled LCP technology for front-end modules is presented. Next, nano-scaled ultra-thin RXP technology is introduced with its integration capability and embedded passive performances. Simulated results of bandpass filter, and antennas for 60 GHz are also presented in this paper. RXP technology provides low cost and promising high performance solution for wireless applications operating around microwave and millimeter frequencies. Magneto-dielectric substrates are proposed for effective miniaturization of antennas.
AB - This paper presents advanced polymers for RF packaging applications including filters and antennas. First, micro-scaled LCP technology for front-end modules is presented. Next, nano-scaled ultra-thin RXP technology is introduced with its integration capability and embedded passive performances. Simulated results of bandpass filter, and antennas for 60 GHz are also presented in this paper. RXP technology provides low cost and promising high performance solution for wireless applications operating around microwave and millimeter frequencies. Magneto-dielectric substrates are proposed for effective miniaturization of antennas.
UR - http://www.scopus.com/inward/record.url?scp=78650059419&partnerID=8YFLogxK
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M3 - Conference contribution
AN - SCOPUS:78650059419
SN - 9782874870163
T3 - European Microwave Week 2010, EuMW2010: Connecting the World, Conference Proceedings - European Microwave Conference, EuMC 2010
SP - 695
EP - 698
BT - European Microwave Week 2010, EuMW2010
T2 - 13th European Microwave Week 2010, EuMW2010: Connecting the World - 40th European Microwave Conference, EuMC 2010
Y2 - 28 September 2010 through 30 September 2010
ER -