Air-gap transmission lines on organic substrates for low-loss interconnects

Todd J. Spencer, Paul Jayachandran Joseph, Tae Hong Kim, Madhavan Swaminathan, Paul A. Kohl

Research output: Contribution to journalArticlepeer-review

22 Scopus citations


The fabrication of low-loss transmission line structures with an air dielectric layer is described. The channels are characterized at low frequency (10 and 100 kHz) using capacitance and loss tangent and at high frequency (500 MHz to 10 GHz) using S-parameter measurements. The incorporation of an air gap resulted in structures with effective dielectric constants between 1.5-1.8 and significantly lower loss tangents. The fabrication technique could be used to create more complicated air gap transmission line structures for use in monolithic microwave integrated circuits.

Original languageEnglish (US)
Pages (from-to)1919-1924
Number of pages6
JournalIEEE Transactions on Microwave Theory and Techniques
Issue number9
StatePublished - Sep 2007

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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