Air-gap transmission lines on organic substrates for low-loss interconnects

Todd J. Spencer; Paul Jayachandran Joseph; Tae Hong Kim; Madhavan Swaminathan; Paul A. Kohl

doi:10.1109/TMTT.2007.904326

Air-gap transmission lines on organic substrates for low-loss interconnects

Todd J. Spencer, Paul Jayachandran Joseph, Tae Hong Kim, Madhavan Swaminathan, Paul A. Kohl

Electrical Engineering

Research output: Contribution to journal › Article › peer-review

22 Scopus citations

Abstract

The fabrication of low-loss transmission line structures with an air dielectric layer is described. The channels are characterized at low frequency (10 and 100 kHz) using capacitance and loss tangent and at high frequency (500 MHz to 10 GHz) using S-parameter measurements. The incorporation of an air gap resulted in structures with effective dielectric constants between 1.5-1.8 and significantly lower loss tangents. The fabrication technique could be used to create more complicated air gap transmission line structures for use in monolithic microwave integrated circuits.

Original language	English (US)
Pages (from-to)	1919-1924
Number of pages	6
Journal	IEEE Transactions on Microwave Theory and Techniques
Volume	55
Issue number	9
DOIs	https://doi.org/10.1109/TMTT.2007.904326
State	Published - Sep 2007

All Science Journal Classification (ASJC) codes

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1109/TMTT.2007.904326

Cite this

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title = "Air-gap transmission lines on organic substrates for low-loss interconnects",

abstract = "The fabrication of low-loss transmission line structures with an air dielectric layer is described. The channels are characterized at low frequency (10 and 100 kHz) using capacitance and loss tangent and at high frequency (500 MHz to 10 GHz) using S-parameter measurements. The incorporation of an air gap resulted in structures with effective dielectric constants between 1.5-1.8 and significantly lower loss tangents. The fabrication technique could be used to create more complicated air gap transmission line structures for use in monolithic microwave integrated circuits.",

author = "Spencer, {Todd J.} and Joseph, {Paul Jayachandran} and Kim, {Tae Hong} and Madhavan Swaminathan and Kohl, {Paul A.}",

note = "Funding Information: Manuscript received November 7, 2006; revised February 19, 2007. This work was supported by the Defense Advanced Research Projects Agency (DARPA)/Microelectronics Advanced Research Corporation (MARCO) Interconnect Focus Center. This work was supported in part by MARCO, its participating companies, and DARPA under Contract 2003-IT-674.",

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doi = "10.1109/TMTT.2007.904326",

language = "English (US)",

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T1 - Air-gap transmission lines on organic substrates for low-loss interconnects

AU - Spencer, Todd J.

AU - Joseph, Paul Jayachandran

AU - Kim, Tae Hong

AU - Swaminathan, Madhavan

AU - Kohl, Paul A.

N1 - Funding Information: Manuscript received November 7, 2006; revised February 19, 2007. This work was supported by the Defense Advanced Research Projects Agency (DARPA)/Microelectronics Advanced Research Corporation (MARCO) Interconnect Focus Center. This work was supported in part by MARCO, its participating companies, and DARPA under Contract 2003-IT-674.

PY - 2007/9

Y1 - 2007/9

N2 - The fabrication of low-loss transmission line structures with an air dielectric layer is described. The channels are characterized at low frequency (10 and 100 kHz) using capacitance and loss tangent and at high frequency (500 MHz to 10 GHz) using S-parameter measurements. The incorporation of an air gap resulted in structures with effective dielectric constants between 1.5-1.8 and significantly lower loss tangents. The fabrication technique could be used to create more complicated air gap transmission line structures for use in monolithic microwave integrated circuits.

AB - The fabrication of low-loss transmission line structures with an air dielectric layer is described. The channels are characterized at low frequency (10 and 100 kHz) using capacitance and loss tangent and at high frequency (500 MHz to 10 GHz) using S-parameter measurements. The incorporation of an air gap resulted in structures with effective dielectric constants between 1.5-1.8 and significantly lower loss tangents. The fabrication technique could be used to create more complicated air gap transmission line structures for use in monolithic microwave integrated circuits.

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Air-gap transmission lines on organic substrates for low-loss interconnects

Abstract

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