Abstract
Thermal, dimensional, and chemical stability make stainless steel foils desirable substrates for flexible AMOLED transistor backplanes. However, the surface roughness and the conductivity of the substrates mean they may not be simple drop-in replacements for glass. We assessed techniques for surface planarization with spin-on glass and benzocyclobutene, and for electrical insulation with silicon dioxide. After the substrates were prepared, active-matrix organic light emitting display (AMOLED) backplanes using hydrogenated amorphous silicon thin-film transistors were fabricated. The backplanes consisted of (48 × 4) × 48 vertical stripe pixels of 92 μm × 369μan with aperture ratio of 48% and resolution of 70ppi. With electron mobilities of up to ∼0.5cm2/Vs the pixel circuits can deliver up to 26μA of current to an electrophosphorescent OLED.
Original language | English (US) |
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Pages (from-to) | 108-111 |
Number of pages | 4 |
Journal | SID Conference Record of the International Display Research Conference |
State | Published - 2006 |
Event | SID 26th International Display Research Conference - Kent, OH, United States Duration: Sep 18 2006 → Sep 21 2006 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering