A dry planarization process utilizing plasma-enhanced chemical vapor deposition (PECVD) of amorphous carbon (a-C:H) films has been developed. The degree of planarization obtained for these films is better than that of many conventional spun-on polymers. Carbon films 2.5 µm thick have been shown to planarize 1.5-µm-deep, 400-µm-wide trenches to within 0.2 µm. The deposition process can be carried out at room temperature with low ion bombardment energy (10 V) and fast deposition rate (300 nm /min). The planarization layers have been used in conjunction with both wet and dry deposited inorganic imaging layers in bilayer resist schemes to form submicrometer patterns.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering