An accurate fast fluid dynamics model for data center applications

Wei Tian, Jim VanGilder, Michael Condor, Xu Han, Wangda Zuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Scopus citations

Abstract

Traditional CFD is broadly useful in the design and operation of reliable and efficient data centers. It is nevertheless computationally expensive, particularly when employed for design optimization, which usually requires multiple simulations. To speed-up calculations while retaining essential airflow physics, several researchers have turned to an alternative CFD methodology, namely, fast fluid dynamics (FFD). FFD has been reported to be much faster than traditional CFD, but at an assumed (acceptable) trade-off of reduced accuracy. However, a recent comparison of FFD and traditional CFD for data center plenum applications produced nearly indistinguishable results and suggested that previously-reported FFD/traditional-CFD differences were due primarily to inconsistent: 1) advection schemes, 2) computational grids, and 3) turbulence models. The present paper extends this FFD/traditional-CFD comparison to the data center whitespace and confirms the finding that a true like-for-like comparison produces nearly identical predictions. Our FFD implementation utilizes a first-order upwind finite-volume scheme for advection like traditional CFD, so alternative advection schemes (e.g., semi-Lagrangian) are not considered further here. Likewise, the effect of grid choice on traditional-CFD predictions is well known. However, the effect of turbulence model for data center applications has not been reported extensively so we do consider this topic further here. We compare the standard k-e and a simpler algebraic model to benchmark experimental data from a real data center. We find that the algebraic turbulence model predicts rack-inlet temperatures at a similar level-of-accuracy as the k-e model for our fairly-simple-airflow reference data center.

Original languageEnglish (US)
Title of host publicationProceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
PublisherIEEE Computer Society
Pages1275-1281
Number of pages7
ISBN (Electronic)9781728124612
DOIs
StatePublished - May 2019
Event18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019 - Las Vegas, United States
Duration: May 28 2019May 31 2019

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2019-May
ISSN (Print)1936-3958

Conference

Conference18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
Country/TerritoryUnited States
CityLas Vegas
Period5/28/195/31/19

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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