An alternate power distribution scheme with superior noise suppression characteristics than EBG

Satyanarayana Telikepalli, Madhavan Swaminathan, David Keezer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

This work presents an efficient power delivery network design for mitigating the coupling of power supply noise in mixed-signal electronics using power transmission lines. Digital circuitry operating at high data rates generates supply noise that can interfere with sensitive RF circuitry. Currently used methods, such as split planes and ferrite beads, have limited isolation bandwidth and can pose difficulties for signal integrity. Electromagnetic bandgap (EBG) structures have also been shown to exhibit excellent noise isolation. In this paper, a set of parallel digital buffers and a low noise amplifier are powered by a power transmission line instead of a voltage plane. An embedded bandstop filter in the power transmission line significantly reduces the amount of coupled noise between the digital and RF supply voltage pins. Test vehicles using this proposed method, as well as using an EBG structure were fabricated and tested. The proposed method shows a 16dB decrease in coupled power as compared to the EBG. Incorporating an EBG in the power delivery network gives rise to impedance peaks that cause larger power supply noise at the supply pin of the buffers. Consequently, the proposed method also demonstrates significant improvement in signal and power integrity by reducing the power supply noise at the source, as shown in the conducted lab measurements.

Original languageEnglish (US)
Title of host publication2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages3-6
Number of pages4
ISBN (Electronic)9781479936410
DOIs
StatePublished - 2014
Event23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 - Portland, United States
Duration: Oct 26 2014Oct 29 2014

Publication series

Name2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014

Conference

Conference23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
Country/TerritoryUnited States
CityPortland
Period10/26/1410/29/14

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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