An analytical model of strain isolation for stretchable and flexible electronics

H. Cheng; J. Wu; M. Li; D. H. Kim; Y. S. Kim; Y. Huang; Z. Kang; K. C. Hwang; J. A. Rogers

doi:10.1063/1.3553020

An analytical model of strain isolation for stretchable and flexible electronics

H. Cheng
, J. Wu
, M. Li
, D. H. Kim
, Y. S. Kim
, Y. Huang
, Z. Kang
, K. C. Hwang
, J. A. Rogers

Research output: Contribution to journal › Article › peer-review

49 Scopus citations

Abstract

One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.

Original language	English (US)
Article number	061902
Journal	Applied Physics Letters
Volume	98
Issue number	6
DOIs	https://doi.org/10.1063/1.3553020
State	Published - Feb 7 2011

All Science Journal Classification (ASJC) codes

Physics and Astronomy (miscellaneous)

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10.1063/1.3553020

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@article{f0a2436995b04e8f8f5fe3edc603e162,

title = "An analytical model of strain isolation for stretchable and flexible electronics",

abstract = "One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.",

author = "H. Cheng and J. Wu and M. Li and Kim, \{D. H.\} and Kim, \{Y. S.\} and Y. Huang and Z. Kang and Hwang, \{K. C.\} and Rogers, \{J. A.\}",

note = "Funding Information: The support from NSF (Grant Nos. DMI-0328162 and ECCS-0824129) is acknowledged. K.C. Hwang acknowledges the support from NSFC, Ministry of Education of China, and National Basic Research Program of China (973 Program, Grant No. 2007CB936803). The first and second authors contributed equally.",

year = "2011",

month = feb,

day = "7",

doi = "10.1063/1.3553020",

language = "English (US)",

volume = "98",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "American Institute of Physics",

number = "6",

}

TY - JOUR

T1 - An analytical model of strain isolation for stretchable and flexible electronics

AU - Cheng, H.

AU - Wu, J.

AU - Li, M.

AU - Kim, D. H.

AU - Kim, Y. S.

AU - Huang, Y.

AU - Kang, Z.

AU - Hwang, K. C.

AU - Rogers, J. A.

N1 - Funding Information: The support from NSF (Grant Nos. DMI-0328162 and ECCS-0824129) is acknowledged. K.C. Hwang acknowledges the support from NSFC, Ministry of Education of China, and National Basic Research Program of China (973 Program, Grant No. 2007CB936803). The first and second authors contributed equally.

PY - 2011/2/7

Y1 - 2011/2/7

N2 - One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.

AB - One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.

UR - https://www.scopus.com/pages/publications/79951807418

UR - https://www.scopus.com/pages/publications/79951807418#tab=citedBy

U2 - 10.1063/1.3553020

DO - 10.1063/1.3553020

M3 - Article

AN - SCOPUS:79951807418

SN - 0003-6951

VL - 98

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 6

M1 - 061902

ER -

An analytical model of strain isolation for stretchable and flexible electronics

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