TY - GEN
T1 - An Enhanced 64-Element Dual-Polarization Antenna Array Package for W-Band Communication and Imaging Applications
AU - Gu, Xiaoxiong
AU - Liu, Duixian
AU - Baks, Chris
AU - Plouchart, Jean Olivier
AU - Lee, Wooram
AU - Valdes-Garcia, Alberto
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/8/7
Y1 - 2018/8/7
N2 - An organic-based multi-layered phased-array antenna package for 94-GHz radar imaging and communication applications is hereby introduced. The package incorporates 64 dual-polarized antenna elements. Direct antenna probing measurements on a fabricated package and full-wave electromagnetic (EM) simulation of the complete design show over 8 GHz bandwidth and 2 dBi gain at 94 GHz. 64-element beam forming and beam steering are evaluated through EM simulations showing 12-degree half-power beam width and lower than -20dB side levels. A novel flip-chip assembly process is introduced to improve module-level yield and scalability by attaching the package with one die that consists of four joint ICs.
AB - An organic-based multi-layered phased-array antenna package for 94-GHz radar imaging and communication applications is hereby introduced. The package incorporates 64 dual-polarized antenna elements. Direct antenna probing measurements on a fabricated package and full-wave electromagnetic (EM) simulation of the complete design show over 8 GHz bandwidth and 2 dBi gain at 94 GHz. 64-element beam forming and beam steering are evaluated through EM simulations showing 12-degree half-power beam width and lower than -20dB side levels. A novel flip-chip assembly process is introduced to improve module-level yield and scalability by attaching the package with one die that consists of four joint ICs.
UR - http://www.scopus.com/inward/record.url?scp=85051971861&partnerID=8YFLogxK
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U2 - 10.1109/ECTC.2018.00038
DO - 10.1109/ECTC.2018.00038
M3 - Conference contribution
AN - SCOPUS:85051971861
SN - 9781538649985
T3 - Proceedings - Electronic Components and Technology Conference
SP - 197
EP - 201
BT - Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 68th IEEE Electronic Components and Technology Conference, ECTC 2018
Y2 - 29 May 2018 through 1 June 2018
ER -