Abstract
A Pd/In/Pd/Pt/Au ohmic contact to n-GaSb is presented with a specific contact resistance of 2.4×10-6 Ωcm2. The annealing temperature range over which the specific contact resistance drops to a minimum, while maintaining a suitable surface morphology, is at least twice that of previously reported ohmic contacts to n-GaSb. Materials characterization using cross-sectional transmission electron microscopy confirms that Ga xIn1-xSb forms at the metal/semiconductor interface, and its formation is believed to be responsible for ohmic behavior.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1667-1672 |
| Number of pages | 6 |
| Journal | Solid-State Electronics |
| Volume | 48 |
| Issue number | 9 |
| DOIs | |
| State | Published - Sep 2004 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry
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