TY - GEN
T1 - An improved phase de-embedding technique for high speed connectors
AU - Campbell, Doug
AU - Morales, Aldo
AU - Agili, Sedig
PY - 2010
Y1 - 2010
N2 - As high-speed data applications, such as USB 3.0, are coming down to the consumer electronic world, there is a need of accurate methods to characterize channel behavior. This paper investigates further S-parameter phase errors when de-embedding a device under test (DUT) from onboard structures. A fixture model containing a DUT is constructed enabling the determination of the de-embedding solutions. From these solutions, new equations for DUT Sparameter phase sensitivity are developed. The improved method enables accurate de-embedding of the phase of highspeed connectors used in consumer electronics hardware.
AB - As high-speed data applications, such as USB 3.0, are coming down to the consumer electronic world, there is a need of accurate methods to characterize channel behavior. This paper investigates further S-parameter phase errors when de-embedding a device under test (DUT) from onboard structures. A fixture model containing a DUT is constructed enabling the determination of the de-embedding solutions. From these solutions, new equations for DUT Sparameter phase sensitivity are developed. The improved method enables accurate de-embedding of the phase of highspeed connectors used in consumer electronics hardware.
UR - http://www.scopus.com/inward/record.url?scp=77950129426&partnerID=8YFLogxK
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U2 - 10.1109/ICCE.2010.5419022
DO - 10.1109/ICCE.2010.5419022
M3 - Conference contribution
AN - SCOPUS:77950129426
SN - 9781424443161
T3 - ICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics
SP - 211
EP - 212
BT - ICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics
T2 - 2010 International Conference on Consumer Electronics, ICCE 2010
Y2 - 11 January 2010 through 13 January 2010
ER -